Demonstation of Advanced Die Attach & Flip Chip Bonder and High Speed Dispense System at Productronica 2015

The AMICRA Microtechnologies' sales team will be returning to the Productronica trade show this year at the Messe München from November 10-13 in Munich, Germany to demonstrate our Advanced Die Attach & Flip Chip Bonder, NOVA Plus, and our High Speed Dispense System. We will be available at Booth: B3.306 to answer your questions on how AMICRA's die bonders and flip chip bonders and other custom solutions can best serve your company's needs, as well as to show our products onsite. To set up an appointment, please email us at: This email address is being protected from spambots. You need JavaScript enabled to view it.

This websites is using cookies.