Exhibiting at Semicon Taiwan 2015

We will be returning again this year to present our high-precision die and flip chip bonders at the SEMICON Taiwan 2015 in Taipei, Taiwan from Sept. 2-4th, 2015 at the Taipei Nangang Exhibition Center, Hall 1. AMICRA representatives will be on hand at booth: 1070 to answer all of your questions. To set up an appointment, please send us an E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

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