Exhibiting at OFC 2019

We are pleased to announce that we will be returning to exhibit at the OFC – Optical Fiber Communication Exhibition again, the world’s largest conference and exhibition for optical communications and networking professionals, being held at the San Diego Convention Center in San Diego CA, USA, from March 05th-07th, 2019. We look forward to seeing you at our booths 5503/5501 to give you detailed insights into our ultra high precision die attach systems, NANO, with 0.3µm precision, and our other die bonding & flip chip bonding machines. For appointments, please This email address is being protected from spambots. You need JavaScript enabled to view it..

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