High Precision Die Bonders to be on Display at Productronica (Nov. 14-17, Munich)

Come and see our high precision die bonders up close from Booth: B2 306 at the Productronica 2017 being held Nov 14-17 at the Messe Muenchen (Munich, Germany). This year we will be exhibiting the NOVA Plus and our very newest machine, NANO, which supports a +/- 0.3µm placement accuracy at 3 Sigma.

To schedule an appointment, please send us at email: This email address is being protected from spambots. You need JavaScript enabled to view it.

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