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ASM AMICRA gets Top 100 seal 2022

ASM AMICRA gets Top 100 seal 2022

ASM AMICRA has been awarded the TOP 100 seal 2022, in the 29th round of the prestigious TOP 100 innovation competition, with the award presented only to the most innovative medium-sized companies. On June 24th, ASM AMICRA will be personally honored for these achievements by the competition’s mentor and science…

Panel-Level Heterogeneous Integration Technology for Analog ICs

Panel-Level Heterogeneous Integration Technology for Analog ICs

An article featuring ASM AMICRA's NOVA+ MTP System and X-Celeprint's MTP technology can be found in the Semiconductor Digest’s August/September 2021 issue, p. 9-11.

20 years anniversary of ASM AMICRA featured in an article on Die Wirtschaftszeitung

ASM AMICRA is being featured in an article on Die Wirtschaftszeitung, on May 28th, 2021, p. 13. Die Wirtschaftszeitung is a medium representing supraregional and international companies in the area of East Bavaria. Follow the link to read the article and the very informative interview with our Managing Director Dr.…

ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips

ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-Thin Chips

Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs REGENSBURG, GERMANY; CORK, IRELAND and RESEARCH TRIANGLE PARK, NC (April 26, 2021) – ASM AMICRA Microtechnologies GmbH (“ASM AMICRA”), a subsidiary of ASM Pacific Technology Limited, announced three new manufacturing…

CIOE Exhibition in Shenzhen

CIOE 2020

Thanks to all visitors who stopped by our booth at the world’s leading optoelectronic event CIOE (China International Optoelectronic Exposition) 2020 in Shenzhen!At booth 8D23-1 in the area of the German Pavilion our team was pleased about the interested visitors.We are already looking forward to all visitors next year who…

ASM AMICRA is being featured in an article on "Novus Light Technologies Today"

ASM AMICRA is being featured in an article on "Novus Light Technologies Today", a strong medium in the field of photonics subjects. Follow the link to read the very interesting interview with our Managing Director Dr.Johann Weinhändler. https://www.novuslight.com/insights-from-european-ceos-epic-interviews-md-of-asm-amicra-microtechnologies_N10151.html

OFC 2020 - Attend as our guest!

We are looking forward to returning again to exhibit at the OFC- Optical Fiber Communication Exhibition, the largest global conference and exhibition for optical communications and networking professionals, being held at the San Diego Convention Center in San Diego, California from March 10-12th, 2020. Stop by our booth: 1817 and…

ASM AMICRA CoS wins Productronica Innovation Award

ASM AMICRA CoS wins Productronica Innovation Award

ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder. With this coveted award, Messe München and productronic magazine honor every two years the most innovative new products at the world’s largest trade fair for the electronics industry. The new CoS machine enables…

Exhibiting at OFC 2019

OFC 2019

We are pleased to announce that we will be returning to exhibit at the OFC – Optical Fiber Communication Exhibition again, the world’s largest conference and exhibition for optical communications and networking professionals, being held at the San Diego Convention Center in San Diego CA, USA, from March 05th-07th, 2019.…

ASM AMICRA to demonstrate Ultra-Precision Die Bonder NANO at China International Import Expo: 5-10 November (Shanghai)

ASM AMICRA to demonstrate Ultra-Precision Die Bonder NANO at China International Import Expo: 5-10 November (Shanghai)

We are happy to announce that we will be demonstrating the NANO, our ultra-precision die and flip chip bonder for highly demanding assembly tasks, at the 2018 China International Import Expo from November 5-10 at the National Exhibition & Convention Center in Shanghai. You can see the NANO in action…

Article on Submicron Photonics Placement found on All-Electronics

Article on Submicron Photonics Placement found on All-Electronics

A German-language article on submicron photonics placement ("Submikron Photonik Platzierung genauer betrachten") written by our Regional Sales Manager (USA East), David Halk, can be found online on All-Electronics.de

A Closer Look into Sub-micron Die Placement: Cpk and Cmk

A Closer Look into Sub-micron Die Placement: Cpk and Cmk

ASM AMICRA Microtechnologies' Product Manager, David Halk, has contributed an article "A Closer Look into Sub-micron Die Placement: Cpk and Cmk" in the May/June issue of Chip Scale Review. To become familiar with the terms Cpk and Cmk and their significance when selecting an automated tool for a bonding process…

A New Era Begins for AMICRA and ASM Pacific Technology

ASM Pacific Technology Acquires Amicra to Enter the Photonics Market Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high precision die bonder…

AMICRA to host EPIC Meeting on Automation Tools for Packaging and Testing at Headquarters

AMICRA to host EPIC Meeting on Automation Tools for Packaging and Testing at Headquarters

AMICRA announces with pleasure that we will be teaming with the European Photonics Industry Consortium (EPIC) to host the EPIC Meeting on Automation Tools for Packaging and Testing at our headquarters in Regensburg, Germany from the 23-24 May, 2019. EPIC is an industry association that promotes the sustainable development of…

Exhibiting at OFC 2018

OFC 2018

We are looking forward to returning again to exhibit at the OFC- Optical Fiber Communication Exhibition, the largest global conference and exhibition for optical communications and networking professionals, being held at the San Diego Convention Center in San Diego, California from March 13-15th, 2018. Stop by our booth: 4717 and…

First Order Received for the NANO Ultra-Precision Die Bonding System

First Order Received for the NANO Ultra-Precision Die Bonding System

AMICRA announces with pleasure the first order of our new NANO Ultra-Precision Die Bonding System from the largest subcon in Taiwan. The NANO is AMICRA's ultra-precision die bonder / flip chip bonder which supports ± 0.3µm @ 3s placement accuracy, offering the highest placement accuracy in its class! It is…

Ultra High Precision Die Attach with 0.3µm Precision

Ultra High Precision Die Attach with 0.3µm Precision

An article on the NANO Ultra Precision Die Bonder can be found in the February 2018 edition of the German-language trade magazine, Elektronik, on page 34.

"Growing at the Speed of Light"- Article in 'European Business'

"Growing at the Speed of Light"- Article in 'European Business'

"Growing at the Speed of Light!"- AMICRA is being profiled in the November issue of "European Business." You can find the full article appearing on page 33 www.european-business.com

High Precision Die Bonders to be on Display at Productronica (Nov. 14-17, Munich)

High Precision Die Bonders to be on Display at Productronica (Nov. 14-17, Munich)

Come and see our high precision die bonders up close from Booth: B2 306 at the Productronica 2017 being held Nov 14-17 at the Messe Muenchen (Munich, Germany). This year we will be exhibiting the NOVA Plus and our very newest machine, NANO, which supports a +/- 0.3µm placement accuracy…

The Newest High Precision Placement System

All-Electronics is currently featuring an article on AMICRA's latest high precision placement system with an accuracy of +/- 0.3µm at 3 sigma. To read the full article in German, please visit All-Electronics' website here.

Amicra Introduces the NANO: Ultra-Precision Die Attach at +/- 0.3 µm Accuracy at 3 sigma

Press Release: AMICRA NANO Launch With its newly announced NANO, an ultra-precision die and flip-chip bonder for highly demanding assembly tasks, AMICRA Microtechnologies GmbH, a worldwide leading vendor of back-end processing equipment for advanced packaging applications, is setting another record mark for die-attach accuracy. The NANO will be introduced this…

AMICRA Announces New Headquarter Building

AMICRA Announces New Headquarter Building

AMICRA announces with pleasure the official opening this week of our new headquarter building at Marie-Curie-Str.6 in Regensburg, Germany. The new much larger facility merges the staff from previous locations in Wernerwerkstr. and Lilienthalstr. to now allow for everyone to be on one single campus. The entire AMICRA team is…

Feature Article "New High-Speed Precision Dispensing System" in Global SMT & Packaging

Feature Article "New High-Speed Precision Dispensing System" in Global SMT & Packaging

An article on our High-Speed Precison Dispensing System, HDS, is featured on pages 18-21 of the May 2017 issue of Global SMT & Packaging. The current issue with the article can be found here.

Article on High Speed Precision Dispense System featured on All Electronics

All-Electronics is currently featuring an article on the AMICRA High Speed & Precision Dispense System, HDS, on their website. The entire article can be found on their website.

AMICRA Exhibiting at Optical Fiber Communication Conference and Exhibition (OFC) 2017

AMICRA Exhibiting at Optical Fiber Communication Conference and Exhibition (OFC) 2017

We will be returning again this year to exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) being held at the Los Angeles Convention Center in Los Angeles, California, USA. AMICRA representatives will be available at Booth: 2227 to answer your questions about our submicron die attach solutions and…

New Sales Distribution Partnership in Japan

New Sales Distribution Partnership in Japan

We are happy to announce our newest sales distibution partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo. The partnership which officially started on 1 December designates Kanematsu as the exclusive distributor and contact point for sales and service matters for the entire AMICRA Microtechnologies product line…

AMICRA at the International Wafer-Level Packaging Conference (IWLPC)

AMICRA at the International Wafer-Level Packaging Conference (IWLPC)

AMICRA will be returning again this year to exhibit (Booth: 14) at the International Wafer-Level Packaging Conference (IWLPC 2016) taking place from Oct. 18-19th in San Jose, California. The IWLPC Conference, which is now in its 16th year, "brings together the semiconductor industry's most respected authorities to address all aspects…

Exhibitor at SEMICON Taiwan & CIOE

Exhibitor at SEMICON Taiwan & CIOE

Next week we will be exhibiting at both the SEMICON Taiwan in Taipei, Taiwan (7-9 September) and at the CIOE in Shenzhen, China (6-9 September). SEMICON Taiwan, being held at the Taipei Nangang Exhibition Center, is one of the most influential microelectronics industry events which takes place annually in Taiwan.…

Exhibiting at SEMICON West 2016

Exhibiting at SEMICON West 2016

We will be returning this year to exhibit from booth: 6173 at the SEMICON West 2016 taking place from July 12th-14th, 2016 at the Moscone Center in San Francisco, California. "The 46th annual SEMICON West has over 700 exhibitors, connection to over 26,000 professionals from across the entire electronics supply…

AMICRA to Provide Precision Die Attach System to Fabrinet in Silicon Valley

AMICRA to Provide Precision Die Attach System to Fabrinet in Silicon Valley

AMICRA is pleased to announce that we have received an order for the AFC Plus System from Fabrinet West. The equipment will be installed in Fabrinet’s state-of-the-art optical packaging service facility in Santa Clara, California. AMICRA and Fabrinet have agreed to establish a partnership agreement whereby both companies will work…

AMICRA at the Electronic Components and Technology Conference (ECTC) 2016

AMICRA at the Electronic Components and Technology Conference (ECTC) 2016

AMICRA will be exhibiting our entire product line at the Electronic Components and Technology Conference (ECTC) 2016 held on June 1-2, 2016 at The Cosmopolitan of Las Vegas in Las Vegas, NV. The Electronic Components and Technology Conference "is the premier international event that brings together the best in packaging,…

AMICRA to Deliver NOVA FanOut Bonder to Asian Contractor

AMICRA to Deliver NOVA FanOut Bonder to Asian Contractor

AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for its NOVA FanOut Large-Panel Die/Flip-Chip Bonder from a large Asian subcontractor located in Taiwan. The AMICRA NOVA FanOut, to be delivered in July 2016, will be part of a large…

Sub Micron Die Attach Solutions Ad in Chip Scale Review (March/April 2016)

Sub Micron Die Attach Solutions Ad in Chip Scale Review (March/April 2016)

The AMICRA advertisement highlighting our sub micron die attach solutions can currently be found on page 27 of the March/April 2016 edition of Chip Scale Review. To see the advertisement, please visit Chip Scale Review's website or the link here. For more information on our ultra precision die placement and…

AMICRA's Opto Packaging Solutions at OFC 2016

AMICRA's Opto Packaging Solutions at OFC 2016

Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for your company's needs at the Optical Fiber Communication Conference and Exhibition, OFC 2016, taking place from March 22-24, 2016 at the Anaheim Conventionc Center in Anaheim, California, USA. The OFC…

Exhibiting at the European 3D Summit

Exhibiting at the European 3D Summit

AMICRA will be exhibiting at the European 3D Summit from 18-20 January in Grenoble, France held at the MINATEC innovation campus. Please stop by booth 4 to find out how we can meet your die attach needs and TSV technology.

Demonstation of Advanced Die Attach & Flip Chip Bonder and High Speed Dispense System at Productronica 2015

Demonstation of Advanced Die Attach & Flip Chip Bonder and High Speed Dispense System at Productronica 2015

The AMICRA Microtechnologies' sales team will be returning to the Productronica trade show this year at the Messe München from November 10-13 in Munich, Germany to demonstrate our Advanced Die Attach & Flip Chip Bonder, NOVA Plus, and our High Speed Dispense System. We will be available at Booth: B3.306…

AMICRA at IWLPC 2015

AMICRA at IWLPC 2015

Next week, AMICRA will be exhibiting from Booth:11 at the IWLPC- International Wafer-Level Packaging Conference and Exhibition held at the DoubleTree by Hilton Hotel, San Jose, CA from October 13-14. Managing Director, Dr. Johann Weinhändler, and Regional Sales Manager, Joe Ettipio, will be on-hand to answer your questions about the…

Exhibiting at Semicon Taiwan 2015

Exhibiting at Semicon Taiwan 2015

We will be returning again this year to present our high-precision die and flip chip bonders at the SEMICON Taiwan 2015 in Taipei, Taiwan from Sept. 2-4th, 2015 at the Taipei Nangang Exhibition Center, Hall 1. AMICRA representatives will be on hand at booth: 1070 to answer all of your…

AMICRA at CIOE 2015

AMICRA at CIOE 2015

AMICRA will be exhibiting at Booth: 1112 from August 31st - September 3rd at the CIOE- China International Optoelectronic Expo 2015 held at the Shenzhen Conference & Exhibition Center in Shenzhen, China. Regional Sales Manager, Heng Song Lim will be there to answer your questions on how AMICRA's die bonders…

Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)

Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)

"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at faster rates. This is putting pressure on assembly equipment suppliers to offer advanced tools and processes that push the envelope of ultra-precise die placement."

Advertisement in Chip Scale Review (May/June) 2015

Advertisement in Chip Scale Review (May/June) 2015

Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can be found on page 41 of the current May/June 2015 issue of Chip Scale Review. The magazine in entirety, as well as our advertisement can be found here.

AMICRA at SEMICON West 2015

AMICRA at SEMICON West 2015

AMICRA will be returning again this year to exhibit at the SEMICON West 2015 held at the Moscone Center in San Francisco from July 14-16th. Be sure to stop by our Booth: N Hall 6273 to hear more about our Ultra Precision Die and Flip Chip Bonders for Advanced Semiconductor…

Exhibitor at ECTC 2015

Exhibitor at ECTC 2015

During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at the ECTC 2015 held at the Sheraton San Diego Hotel & Marina in San Diego, California from Wednesday, May 27th- Thursday, May 28th. Managing Director, Dr. Johann Weinhändler and Regional Sales Manager (USA/Canada…

AMICRA to exhibit at SEMICON Southeast Asia 2015

AMICRA to exhibit at SEMICON Southeast Asia 2015

In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015 held from April 22-24th, 2015 at the SPICE Arena in Penang, Malaysia. Managing Director, Dr. Johann Weinhändler and Regional Sales Manager, Heng Song Lim, will be available at booth 104 to answer…

AMICRA at OFC 2015

AMICRA at OFC 2015

AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference and Exposition) taking place from March 24-26th, 2015 at the Los Angeles Convention Center, Los Angeles, California, USA. Managing Director, Dr. Johann Weinhändler and Rudolf Kaiser along with Regional Sales Managers, David Halk and Joe…

AMICRA exhibiting at IMAPS- 11th International Conference and Exhibition on Device Packaging

AMICRA exhibiting at IMAPS- 11th International Conference and Exhibition on Device Packaging

AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from March 17th-18th, 2015 at the IMAPS-11th International Conference and Exhibition on Device Packaging taking place at the WekoPa Resort and Casino in Fountain Hills, Arizona USA, to discuss the AMICRA…

NOVA FanOut Brochure & Product Page Now Online

NOVA FanOut Brochure & Product Page Now Online

The NOVAFanOut Product page is now online and the correpsonding brochure available to download. To read more about the NOVAFanOut or request a brochure, click here.

Feature Article in WIKO Jan 2015

Feature Article in WIKO Jan 2015

A feature article on AMICRA as a technological leader in die bonding can be currently found in the first edition of 2015 of WIKO- Wirtschaft konkret on p. 14-17. To read the complete article on AMICRA's state of the art technology please visit WIKO's site or download the PDF.

Exhibitor at European 3D TSV Summit 2015

Exhibitor at European 3D TSV Summit 2015

AMICRA will be exhibiting at booth 9 from January 20-21st in Grenoble, France at the European 3D/TSV Summit held at the MINATEC innovaction campus. To schedule an appointment at the show, please send us an Email.

AMICRA at IWLPC 2014

AMICRA at IWLPC 2014

AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC (International Wafer-Level Packaging Conferece) 2014 from November 11-12, 2014 at the DoubleTree by Hilton Hotel in San Jose, CA. Stop by our booth or set up an appointment to discuss…

AMICRA Welcomes Joe Ettipio as Sales Manager for the U.S. Western Region

AMICRA Welcomes Joe Ettipio as Sales Manager for the U.S. Western Region

AMICRA Microtechnologies GmbH is pleased to announce the newest addition to its sales management team, Mr. Joe Ettipio. Joe is the second addition to the U.S. Sales management team this year, and will be responsible specifically for the Western region of the United States. Joe brings along with him 24…

Order from multinational telecommunications equipment company

Order from multinational telecommunications equipment company

AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company based in Asia. The purchase was for the AMICRA AFC system. This system will be used for the purpose of providing optical device solutions.

Presentation at IMAPS Int. Symposium on Microelectronics 2014

Presentation at IMAPS Int. Symposium on Microelectronics 2014

AMICRA Regional Sales Manager, David Halk, will be presenting on Advanced Packaging & Assembly at the IMAPS Int. Symposium on Microelectronics 2014 held on October 16th, 2014 from 1:30-1:55 PM at the Town & Country Resort & Conference Center in San Diego, CA. David's presentation is entitled "A Decade of…

Appearance in Economic Daily News (Taiwan)

Appearance in Economic Daily News (Taiwan)

An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily News in Taiwan (September 2014). The article includes a photo of AMICRA Managing Director, Dr. Johann Weinhändler, Regional Sales Manager for Asia, Mr. Heng Song Lim and the director of our Taiwan…

AMICRA at ECOC 2014

AMICRA at ECOC 2014

In just under two weeks (Sept. 22-24, 2014), AMICRA will be exhibiting from Booth 527 at ECOC 2014 held at the Palais des Festivals et des Congrès de Cannes (Cannes, France). Learn more about the AMICRA die bonders and flip chip bonders and how they can meet your fiber optic…

Feature in "SiS" Executive View

Feature in "SiS" Executive View

An article by AMICRA Managing Director, Dr. Johann Weinhändler, discussing silicon photonics is being featured in the "Executive View" of the SiS- Silicon Semiconductor (Volume 36 Issue 3 2014) issue. To read the entire article on page 3, please visit SiS- Silicon Semiconductor's website or click here for the link…

AMICRA at Semicon Taiwan 2014

AMICRA at Semicon Taiwan 2014

AMICRA Microtechnologies will be exhibiting the first week of September (Sept. 3-5, 2014) from Booth 1270 at Semicon Taiwan taking place at the TWTC Nangang Exhibition Hall in Taipei, Taiwan. AMICRA Managing Director, Dr. Johann Weinhaendler, and Regional Sales Manager for Asia, Heng Song Lim, will be onsite to answer…

New Sales Distributor in the Philippines

New Sales Distributor in the Philippines

AMICRA is happy to announce Globaltech Automation, Inc. as the newest addition to our Asian sales representatives team. Globaltech Automation, Inc. will be responsible for the Philippines sales region. Visit our contact page to connect with Globaltech Automation Inc., or visit their website at: www.globaltechphil.com.

Exhibiting at SEMICON WEST 2014

Exhibiting at SEMICON WEST 2014

In just under a month, AMICRA will be exhibiting from Booth 6260 located in the North Hall of the Moscone Center in San Francisco, California at SEMICON West 2014 (July 8-10, 2014). AMICRA Managing Director, Dr. Johann Weinhaendler as well as US Sales Manager, David Halk and representative Walter Gisler…

AMICRA at ECTC 2014

AMICRA at ECTC 2014

Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida, USA and have Managing Director, Dr. Johann Weinhaendler answer your questions about the AFC Plus and NOVA Plus…

Large panel fan-out wafer-level packaging: accuracy is king

Large panel fan-out wafer-level packaging: accuracy is king

AMICRA article in Chip Scale Review (March/April 2014) CSR March/April 2014 A 3-page article entitled "Large panel fan-out wafer-level packaging: accuracy is king" written by AMICRA Managing Director, Dr. Johann Weinhändler, can be found in the current March/April 2014 issue of Chip Scale Review. The discussion on fan-out wafer-level processing…

Leading Optical Device Subcon in Thailand select AFC Plus

Leading Optical Device Subcon in Thailand select AFC Plus

We are pleased to announce that a leading optical device Subcon in Thailand selected the AFCPlus die bonder/flip chip bonder for their R&D lab. The system is fully equipped and allows the assembly of all kinds of optical devices such as VCSELs, PD, LD, Lenses on PCB or Silicon substrates.…

Order from Germany for NOVA Plus System

Order from Germany for NOVA Plus System

AMICRA is happy to share that an order has been received from Germany for the NOVAPlus die bonder and flip chip bonder system, to be used for VCSEL & PIN attach for an active optical cable.

Reorder of AIS from one of largest IDMs

Reorder of AIS from one of largest IDMs

AMICRA has received a reorder out of Malaysia for the AIS Wafer Inking system from one of the largest IDMs.

Reorder of NOVA Plus from leading optical device manufacturer

Reorder of NOVA Plus from leading optical device manufacturer

A leading optical device manufacturer from Asia has reordered a NOVAPlus die bonder and flip chip bonder from AMICRA. The system will be utilized for VCSEL & PIN attach application.

Exhibitor at OFC 2014

Exhibitor at OFC 2014

AMICRA will be one of the exhibitors participating in the OFC 2014 from March 11-13, 2014 at the Moscone Center in San Franciso, CA. Managing Director, Dr. Johann Weinhändler, will be on-site at Booth: 3355 presenting the AMICRA die bonder and flip chip bonders (AFCPlus und NOVAPlus) and will be…

Shipment of first NOVA system with 300mm FOUP Loader

Shipment of first NOVA system with 300mm FOUP Loader

We are happy to announce the shipment of the first NOVA system with a 300mm FOUP Loader. The system will be installed for a Silicon Photonics application in a Class 10 Clean room.

AMICRA presenting at IMAPS Int. Exhibition on Device Packaging 2014

AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on hand from March 11- 12, 2014 at Booth 64 at the IMAPS Int. Exhibition on Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ to…

AMICRA Welcomes Newest Regional Sales Manager- Mr. Dave Halk

AMICRA Welcomes Newest Regional Sales Manager- Mr. Dave Halk

AMICRA Microtechnologies GmbH is happy to announce that Mr. Dave Halk will be the latest addition to our Regional Sales Management team, with a primary focus of serving the market of the USA eastern region. Halk has an extensive technical background serving the Advanced Packaging market within the electronic assembly…

Video on TV Aktuell Fernsehen für Ostbayern

A short video on AMICRA's innovation process and views of our die bonders/flip chip bonders can be currently found on TVA Fernsehen für Ostbayern. Watch the video by clicking here.

AMICRA at SEMICON Korea 2014

AMICRA at SEMICON Korea 2014

AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager for Asia, Heng Song Lim will be onsite at booth 4042 to meet visitors and answer your questions about the AMICRA die bonders and flip chip bonders.

New Distributor in Israel

New Distributor in Israel

AMICRA would like to welcome our newest distributor PAiTECH Co., Ltd. PAiTECH will be the distributor in Israel for AMICRA die bonders/ flip chip bonders and other products. Visit our contact page to get in contact with PAiTECH.

Story on AMICRA in "productronic"

Story on AMICRA in "productronic"

A story on AMICRA's AFCPlus die bonder and flip chip bonder and NOVAPlus die bonder and flip chip bonder, along with photos, can be found on page 38 of the December 2013 edition of productronic. Visit their website (productronic.de) or pick up a copy of the December issue to read…

News & Highlights Feature on AMICRA Die Bonders in EPP

A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip chip bonder is appearing starting on November 26th in EPP- Elektronik Produktion & Prüftechnik. Visit their website to read the full article: http://www.epp-online.de/news/-/article/32536724/38813779/

AMICRA at IWLPC 2013

AMICRA at IWLPC 2013

Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013, in San Jose, CA to answer your questions about the AFC Plus Die Bonder and Flip Chip Bonder / NOVA Plus Die Bonder and Flip Chip Bonder and AMICRA's other…

Come Visit AMICRA at Productronica 2013

Come Visit AMICRA at Productronica 2013

Please come by and visit AMICRA at Productronica in Munich, Germany from 12-15 November, 2013 at Hall/Stand: B2.376 and see the NOVAPlus and AFCPlus Die Bonder and Flip Chip bonders in person! AMICRA's managing directors will be on hand to answer any questions presented. We look forward to your attendance!

AMICRA on Cover of SiS Magazine

AMICRA on Cover of SiS Magazine

The current issue of Silicon Semiconductor (SiS) is featuring AMICRA as its cover story! Don't forget to read the 3 page feature story found on pages 26-28 and take a peak at the advertisement for the Nova Plus and AFC Plus die bonder and flip chip bonders on page 9.…

Volume order received for AFC Plus

Volume order received for AFC Plus

AMICRA has received a volume order for several AFCPlus Die Bonders/Flip Chip Bonders, which will be installed by a Subcon in Thailand.

AMICRA Appears in Taiwan press

AMICRA Appears in Taiwan press

The Taiwanese media recently featured AMICRA's NOVAPlus and AFCPlus die bonder and flip chip bonders in various press. Click on the images to see the news/advertisement.

Founding of AMICRA PTE Ltd. in Singapore

AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of AMICRA PTE Ltd. on 2 September 2013, in Singapore. The concept of AMICRA PTE Ltd., came to fruition as a means for AMICRA, the die bonder and flip chip bonder…

AMICRA in Economic Daily News (Taiwan)

AMICRA in Economic Daily News (Taiwan)

A news release on AMICRA is appearing today in Economic Daily News in Taiwan. Click here for the full article (in Chinese only).

AMICRA featured on I-Micronews

AMICRA featured on I-Micronews

An article on AMICRA demonstrating the AFCPlus and NOVAPlus advanced die bonder and flip chip bonders at Semicon Taiwan 2013 is being featured on I-Micronews under "Advanced Packaging." Read the full article by clicking here.

AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)

AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)

An article on AMICRA's continual success was featured in the current 23 August, 2013 issue of the Bavarian newspaper, the Mittelbayerische Zeitung.

AMICRA to Participate at SEMICON Taiwan 2013

AMICRA to Participate at SEMICON Taiwan 2013

Please come visit AMICRA presenting the NOVAPlus and AFCPlus die bonder and flip chip bonder at booth L1024 at SEMICON Taiwan 2013 taking place at the Nangang Exhibition Hall at the Taipei World Trade Centre in Taipei, Taiwan from Sept 4-6, 2013. On-site will be AMICRA Managing Director, Dr. Johann…

Mr. Heng Song Lim joins AMICRA’s Sales Management team

Mr. Heng Song Lim joins AMICRA’s Sales Management team

AMICRA Microtechnologies would like to announce the addition of Mr. Heng Song Lim to our Sales Management team. Mr. Heng Song Lim brings with him an extensive amount of valuable, global experience in the industry field. Most recently Mr. Heng Song Lim served as the Asia Pacific Business Manager for…

First NOVA Plus Production System Sale for Large Area Fan-Out Application

First NOVA Plus Production System Sale for Large Area Fan-Out Application

AMICRA is pleased to announce the first NOVA Plus production system sale for large area fan-out application with a panel size of 370 x 470 to one of the largest semiconductor packaging subcontractors in Taiwan.

New Distribution Agreement in Russia

AMICRA is pleased to report the signing of a new distribution agreement with United R&D Lab., JSC located in St. Petersburg, Russia to serve as a distributor of AMICRA products to the Russian Federation.

New Distribution Agreement in the northwest USA

New Distribution Agreement in the northwest USA

AMICRA is happy to announce that our presence in the USA will be expanding to the states of Oregon, Washington, Idaho and Utah through the recently signed distribution agreement with distributor NW Test Solutions.

AMICRA’s First System Sale to HDD Market

AMICRA’s NOVAPlus slected for high volume HDD assembly. This is AMICRA’s first system sale to the HDD market.

AMICRA in Chip Scale Review

See the NovaPlus Die / Flip Chip Bonder and the AFCPlus Die / Flip Chip Bonder featured on pages 28 & 29 of the July-August 2013 edition of Chip Scale Review.

AMICRA takes part in university career fair

AMICRA takes part in university career fair

AMICRA was one of the participating exhibitors to meet with students and prospective job-seekers at the "Career Contact 2013" career fair held at the University of Regensburg on the 12th of June, 2013.

AMICRA expands in Regensburg: Second location in West district

AMICRA expands in Regensburg: Second location in West district

AMICRA, the Regensburg manufacturer of high-precision assembly systems, as well as test and marking systems in the microelectronics and semiconductor industry has been on a steady growth path in the recent years. This course of growth has led to a significant expansion in both the production area in the Wernerwerkstraße…

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