2021

  • CoSPro and NOVAPro product launch
  • Trade Show Participation: OFC (USA); SEMICON China (China); ECOC (France); CIOE (China); productronica (Munich, Germany)

2020

  • Trade Show Participation: NEPCON Japan (Japan); OFC (USA); CIOE (China)

2019

  • ASM AMICRA CoS wins the Productronica Innovation Award
  • Trade Show Participation: OFC (USA); SEMICON Korea (South Korea); SEMICON China (China); EPIC Inhouse at ASM AMICRA (Regensburg, Germany); IMAPS International Device Packaging Exhibition (USA); SEMICON West (USA); ECOC (Ireland); CIOE (China); productronica (Munich, Germany)

2018

  • Aquired by ASMPT and have been renamed to ASM AMICRA Microtechnologies GmbH
  • Trade Show Participation: Nepcon Japan (Japan); SEMICON Korea (South Korea); IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); ECOC (Italy); CIOE (China); CIIE (China)

2017

  • Official product launch of the NANO Die Bonder and Flip Chip Bonder
  • Opening of new headquarters at Marie-Curie-Str. 6 in Regensburg, Germany
  • Became a member of the EPIC Association
  • Trade Show Participation: European 3D TSV Summit (France); IMAPS International Device Packaging Exhibition (USA); OFC (USA); Nepcon (South Korea); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Sweden); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany); SEMICON Japan (Japan)

2016

  • Kanematsu PWS LTD.,is added to our Asian sales representatives team, covering Japan
  • Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); SEMICON West (USA); CIOE (China); SEMI Taiwan (China/Taiwan); ECOC (Düsseldorf/Germany); IMAPS (USA); IWLPC (USA)


2015

  • Introduction of HDS (High Speed Dispense System)
  • Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015 (USA); OFC (USA); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Spain); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany)

 

2014

  • October      
    • Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
  • July
    • Globaltech Automation is added to our Asian sales representatives team, covering the region of the Philippines
  • January:
    • Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA (See news story Jan. 29, 2014)
    • PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
  • Trade Show Participation: SEMICON Korea (South Korea); OFC (USA); IMAPS Int. Exhibition on Device Packaging (USA)

 

2013

  • September: Founding of AMICRA PTE Ltd. in Singapore.
  • July:
    • The first system sale to the HDD market is signed with a major European LD manufacturer.
    • Announcement of two new distribution agreements- one for the sales territory of the Russian Federation with distributor United R&D Lab., JSC, and the other throughout the northwestern states of the USA with distributor NW Test Solutions).
  • May/June:
    • A second location is added in Regensburg during the 2nd quarter of the year (see news story - 11 June, 2013)
  • Trade Show Participation: SEMICON Taiwan (China/Taiwan); SEMICON West (USA); OFC (USA); IWLPC (USA); productronica (Munich, Germany)

 

2012

  • Delivery of the first LTS Test System and 12" Wafer Inking System.
  • Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
  • Multiple system installations at a major optoelectronic packaging house in Thailand.
  • Trade Show Participation: SMT Hybrid Packaging (Nuremberg, Germany); OFC (USA)

 

2011

  • Increased number of employees from 35 to 48.
  • Start of product development for the LTS (LED & LD) Test system and the 12" Wafer Inking System.
  • Successful product launch of the new AFCPlus High Precision Die Bonder.
  • Acquisition of five new customers in Asia and Europe.
  • Trade Show Participation: SEMICON Taiwan (China/Taiwan); SMT (Nuremberg, Germany); OFC (USA)

 

2010

  • Product launch of the new NOVAPlus High Precision Die Bonder.
  • Largest incoming orders in the company's history.
  • Received the first orders from Taiwan.
  • Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.  
  • Trade Show Participation: SEMICON Taiwan (China/Taiwan), SMT (Nuremberg, Germany), OFC (USA)

 

2009

  • September:
    • Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
  • June :
    • Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
    • Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
  • April :
    • Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
  • February :
  • Trade Show Participation: OFC (USA); SMT (Nuremberg, Germany); SEMICON Singapore (Singapore); productronica (Munich, Germany)

 

2008

  • December:
    • Reconstruction of the company's ownership structure along with recapitalization takes place
  • August:
    • New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
  • 2 AFC die bonders for MEMS Probecard (Korea)
  • Follow-up orders for AFC Flip Chip
  • Follow-up orders for the laser process system (LPS)
  • Trade Show Participation: OFC (USA); SMT; SEMICON Taiwan (China/Taiwan)

 

2007

  • Dispenser production line for pressure sensors is completed
  • Order for AFC Flip Chip (Canada) is placed
  • Follow-up orders for AIS are requested
  • Development of the laser lift off system (LPS)
  • Trade Show Participation: SMT; Laser 2007; productronica (Munich, Germany)

 

2006

  • Delivery of a completed production line for High Speed Die Bonder NOVA
  • Follow-up orders for AIS
  • Process development of bubble-free silicon membrane
  • Automatic measuring system for silicon membrane
  • Trade Show Participation: SMT; Optatec

 

2005

  • Development of the AIS (high speed inking with wafer robot)
  • Commencement of development of the high speed die bonder
  • Trade Show Participation: Laser 2005; SMT; productronica (Munich, Germany)

 

2004

  • Development of the AFC Flip Chip
  • Development of a fully automatic lens characterization system
  • Trade Show Participation: Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT

 

2003

  • Development of the HIGH SPEED Wafer Inking System
  • Development of the AFC Flip Chip
  • Trade Show Participation: SMT; Laser 2003; productronica (Munich, Germany)

 

2001 / 2002

  • Establishment of AMICRA Microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
  • Development of ADB2000 und SDB1000
  • Trade Show Participation: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen

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