History

History of ASM AMICRA Microtechnologies GmbH

CoS^Pro and NOVA^Pro product launch
Trade Show Participation: OFC (USA); SEMICON China (China); ECOC (France); CIOE (China); productronica (Munich, Germany)

ASM AMICRA CoS wins the Productronica Innovation Award
Trade Show Participation: OFC (USA); SEMICON Korea (South Korea); SEMICON China (China); EPIC Inhouse at ASM AMICRA (Regensburg, Germany); IMAPS International Device Packaging Exhibition (USA); SEMICON West (USA); ECOC (Ireland); CIOE (China); productronica (Munich, Germany)

Aquired by ASMPT and have been renamed to ASM AMICRA Microtechnologies GmbH
Trade Show Participation: Nepcon Japan (Japan); SEMICON Korea (South Korea); IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); ECOC (Italy); CIOE (China); CIIE (China)

Official product launch of the NANO Die Bonder and Flip Chip Bonder
Opening of new headquarters at Marie-Curie-Str. 6 in Regensburg, Germany
Became a member of the EPIC Association
Trade Show Participation: European 3D TSV Summit (France); IMAPS International Device Packaging Exhibition (USA); OFC (USA); Nepcon (South Korea); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Sweden); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany); SEMICON Japan (Japan)

Kanematsu PWS LTD.,is added to our Asian sales representatives team, covering Japan
Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition (USA); OFC (USA); ECTC (USA); SEMICON West (USA); CIOE (China); SEMI Taiwan (China/Taiwan); ECOC (Düsseldorf/Germany); IMAPS (USA); IWLPC (USA)

Introduction of HDS (High Speed Dispense System)
Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015 (USA); OFC (USA); SEMICON Southeast Asia (Malaysia); ECTC (USA); SEMICON West (USA); CIOE (China); SEMICON Taiwan (China/Taiwan); ECOC (Spain); IMAPS (USA), IWLPC (USA); productronica (Munich/Germany)

October
- Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
July
- Globaltech Automation is added to our Asian sales representatives team, covering the region of the Philippines
January:
- Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA (See news story Jan. 29, 2014)
- PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
Trade Show Participation: SEMICON Korea (South Korea); OFC (USA); IMAPS Int. Exhibition on Device Packaging (USA)

July:
- The first system sale to the HDD market is signed with a major European LD manufacturer.
- Announcement of two new distribution agreements- one for the sales territory of the Russian Federation with distributor United R&D Lab., JSC, and the other throughout the northwestern states of the USA with distributor NW Test Solutions).
May/June:
- A second location is added in Regensburg during the 2nd quarter of the year (see news story - 11 June, 2013)
Trade Show Participation: SEMICON Taiwan (China/Taiwan); SEMICON West (USA); OFC (USA); IWLPC (USA); productronica (Munich, Germany)

Delivery of the first LTS Test System and 12" Wafer Inking System.
Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
Multiple system installations at a major optoelectronic packaging house in Thailand.
Trade Show Participation: SMT Hybrid Packaging (Nuremberg, Germany); OFC (USA)

Increased number of employees from 35 to 48.
Start of product development for the LTS (LED & LD) Test system and the 12" Wafer Inking System.
Successful product launch of the new AFC^Plus High Precision Die Bonder.
Acquisition of five new customers in Asia and Europe.
Trade Show Participation: SEMICON Taiwan (China/Taiwan); SMT (Nuremberg, Germany); OFC (USA)

Product launch of the new NOVA^Plus High Precision Die Bonder.
Largest incoming orders in the company's history.
Received the first orders from Taiwan.
Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.
Trade Show Participation: SEMICON Taiwan (China/Taiwan), SMT (Nuremberg, Germany), OFC (USA)

September:
- Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
June :
- Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
- Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
April :
- Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
February :
- Dr. Johann Weinhaendler joins the management team as head of sales, marketing and business development.
Trade Show Participation: OFC (USA); SMT (Nuremberg, Germany); SEMICON Singapore (Singapore); productronica (Munich, Germany)

December:
- Reconstruction of the company's ownership structure along with recapitalization takes place
August:
- New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
2 AFC die bonders for MEMS Probecard (Korea)
Follow-up orders for AFC Flip Chip
Follow-up orders for the laser process system (LPS)
Trade Show Participation: OFC (USA); SMT; SEMICON Taiwan (China/Taiwan)

Development of the AFC Flip Chip
Development of a fully automatic lens characterization system
Trade Show Participation: Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT

Establishment of AMICRA Microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
Development of ADB2000 und SDB1000
Trade Show Participation: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen