ASM AMICRA's AIS fully automatic, high-speed ink system is for inking diced and undiced wafers (up to 20 dots/s) with a dot size down to 70 µm.
The AIS Fully-Automatic, High-Speed Wafer Inking System has a wide range of features including the following:
- high speed inking
- inking of diced and undiced wafers up to 20 dots/s
- up to 3 inking units
- contactless inking
- dot size down to 70 µm
- vision system
- ink dot control
- microscope with optical zoom for manual inspection
- wafermap SEMI- standard
- bar code reader
- automatic wafer loading
- platform available in 4,6,8" or 8, 12"
The AIS Fully-Automatic, High-Speed Wafer Inking System is designed for the following markets/ applications:
Interested in our AIS Fully-Automatic, High-Speed Wafer Inking System? Our support team is waiting for your call-worldwide.