Nova Fan Out - Die Bonder and Flip Chip Bonder

AMICRA's optimal die bonding machine for the fanout process.


The Nova FanOut Die Bonder / Flip Chip Bonder has a wide range of features including the following:

  • high precision die bonder / flip chip bonder system
  • fully automatic system
  • modular machine concept
  • accuracy +/- 3 µm @ 3 sigma placement accuracy 
  • FOUP loading system for up to 300mm substrate wafer
  • substrate working area 550 x 600mm
  • wafer mapping
  • dynamic aligment
  • high bond force capability
  • pre and post bond inspection

Autoloading for up to:

  • 300mm wafer on frame
  • 600mm substrate

Optional

  • multi-flip chip


The Nova FanOut Die Bonder / Flip Chip Bonder is designed for the following applications:

  • WLP
  • MCP
  • SiP
  • PoP
  • eWLB
  • embedded die
  • TSV
  • MCM


 


For a more detailed written description, please read below…

AMICRA Microtechnologies‘ NOVAFanOut is the optimal machine for the fanout process. With a large substrate area which can accommodate a 550 mm x 600 mm substrate in an inline conveyor system, it has a best placement accuracy of 3 µm. Depending on the requested placement accuracy, the UPH can be up to 3000 (more possible upon request).

The NOVAFanOut supports special software options to optimize placement accuracy to the customer’s front-end equipment. Its unique dynamic alignment system ensures repeatable component placement while automatically compensating for environment changes. Additionally the NOVAFanOut supports heated options for advanced fanout processes and much more!


Product Brochure

Brochures can be downloaded, upon receipt of contact details


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