CoS Die Bonder

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

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AFC Plus - Die Bonder und Flip Chip Bonder

ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.

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Nova Plus - Die Bonder und Flip Chip Bonder

ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1.0 µm), with multi-chip capability, a modular machine concept and much more!

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NANO - Die Bonder und Flip Chip Bonder

ASMPT AMICRA’s ultra-precision die bonder / flip chip bonder which supports ± 0.2µm @ 3s placement accuracy, offering the highest placement accuracy in its class!

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High Speed Dispense Systems

ASMPT AMICRA's Fully Automatic Inline High Speed Reel to Reel, Lead or Frame Dispensing Line

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