AMICRA's Opto Packaging Solutions at OFC 2016

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Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for your company's needs at the Optical Fiber Communication Conference and Exhibition, OFC 2016, taking place from March 22-24, 2016 at the Anaheim Conventionc Center in Anaheim, California, USA. The OFC is the "largest global conference and exhibition for optical communications and networking professionals "(OFC Official Website). AMICRA representatives will be onhand at booth: 3100 to answer your questions. To set up an appointment, please contact us at: This email address is being protected from spambots. You need JavaScript enabled to view it.

News

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Exhibiting at OFC 2018
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Ultra High Precision Die Attach with 0.3µm Precision
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Article on High Speed Precision Dispense System featured on All Electronics
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AMICRA's Opto Packaging Solutions at OFC 2016
Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for…
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AMICRA at IWLPC 2015
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AMICRA at CIOE 2015
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Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA at SEMICON West 2015
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NOVA FanOut Brochure & Product Page Now Online
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Story on AMICRA in "productronic"
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AMICRA in Economic Daily News (Taiwan)
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AMICRA in Chip Scale Review
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AMICRA takes part in university career fair
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