AMICRA's Opto Packaging Solutions at OFC 2016

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Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for your company's needs at the Optical Fiber Communication Conference and Exhibition, OFC 2016, taking place from March 22-24, 2016 at the Anaheim Conventionc Center in Anaheim, California, USA. The OFC is the "largest global conference and exhibition for optical communications and networking professionals "(OFC Official Website). AMICRA representatives will be onhand at booth: 3100 to answer your questions. To set up an appointment, please contact us at: This email address is being protected from spambots. You need JavaScript enabled to view it.

News

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