AMICRA at CIOE 2015

  • Thursday, 06 August 2015 13:56

AMICRA will be exhibiting at Booth: 1112 from August 31st - September 3rd at the CIOE- China International Optoelectronic Expo 2015 held at the Shenzhen Conference & Exhibition Center in Shenzhen, China. Regional Sales Manager, Heng Song Lim will be there to answer your questions on how AMICRA's die bonders and flip chip bonders can best serve your opto packaging solution needs.

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