AMICRA was one of the participating exhibitors to meet with students and prospective job-seekers at the "Career Contact 2013" career fair held at the University of Regensburg on the 12th of June, 2013.
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder. With this coveted…
A German-language article on submicron photonics placement ("Submikron Photonik Platzierung genauer betrachten") written by our Regional Sales Manager (USA East),…
AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for…
AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company…
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013,…