Before that venture, Mr. Heng Song Lim was the Sales and Marketing Manager for 8 years at Shinkawa Singapore Private Limited, a company headquartered in Japan focused on the design, and manufacturing of wire bonders, die bonders, and die sorters, as well as the die sorter, flip chip bonding and wafer bumping equipment used in the assembly of semiconductors. Here he achieved company global brand awareness as well as won a large order deal with Infineon. Mr. Heng Song Lim also worked for 9 years at ESEC (Asia Pacific) Private Limited, where he was promoted from Sales & Marketing Engineer to Manager. ESEC is headquartered in Cham, Switzerland and designs, manufactures and markets die bonders, wire bonders and flip chip bonding equipment for the semiconductor industry. Here, Mr. Heng Song Lim won new business from Unisem in Malaysia, Astra in Indonesia as well as built and maintained key business relationships with customers.

In addition to his professional experience, Mr. Heng Song Lim has an impressive educational background, earning an MBA degree from the Royal Melbourne Institute of Technology University (RMIT)/ Singapore Institute of Management University (SIM), a bachelor of business administration / marketing from RMIT/SIM, as well as a graduate diploma in marketing management from SIM University, a diploma in management studies from Singapore Institute of Management, and a NTC 2 in Electronics Engineering from Singapore Technical Institute. We are pleased to welcome Mr. Heng Song Lim to our team!