The Taiwanese media recently featured AMICRA's NOVAPlus and AFCPlusdie bonder and flip chip bonders in various press. Click on the images to see the news/advertisement.
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder. With this coveted…
A German-language article on submicron photonics placement ("Submikron Photonik Platzierung genauer betrachten") written by our Regional Sales Manager (USA East),…
AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for…
AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company…
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013,…