AMICRA at IWLPC 2013

  • Monday, 04 November 2013 07:18

Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013, in San Jose, CA to answer your questions about the AFC Plus Die Bonder and Flip Chip Bonder / NOVA Plus Die Bonder and Flip Chip Bonder and AMICRA's other products. We will be displaying at the exhibition on 6- 7th November. Stop by at our stand located at Booth #2!

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