AMICRA at SEMICON Korea 2014

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AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager for Asia, Heng Song Lim will be onsite at booth 4042 to meet visitors and answer your questions about the AMICRA die bonders and flip chip bonders.

News

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Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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Video on TV Aktuell Fernsehen für Ostbayern
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AMICRA at SEMICON Korea 2014
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New Distributor in Israel
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Story on AMICRA in "productronic"
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A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip…
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Come Visit AMICRA at Productronica 2013
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AMICRA on Cover of SiS Magazine
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Founding of AMICRA PTE Ltd. in Singapore
AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of…

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AMICRA in Economic Daily News (Taiwan)
A news release on AMICRA is appearing today in Economic Daily News in Taiwan. Click here for the full article…
AMICRA featured on I-Micronews
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