AMICRA at SEMICON Korea 2014

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AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager for Asia, Heng Song Lim will be onsite at booth 4042 to meet visitors and answer your questions about the AMICRA die bonders and flip chip bonders.

News

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Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA Microtechnologies GmbH is happy to announce that Mr. Dave Halk will be the latest addition to our Regional Sales…

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Video on TV Aktuell Fernsehen für Ostbayern
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AMICRA at SEMICON Korea 2014
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New Distributor in Israel
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Story on AMICRA in "productronic"
A story on AMICRA's AFCPlus die bonder and flip chip bonder and NOVAPlus die bonder and flip chip bonder, along…
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AMICRA on Cover of SiS Magazine
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AMICRA Appears in Taiwan press
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Founding of AMICRA PTE Ltd. in Singapore
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AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)
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Mr. Heng Song Lim joins AMICRA’s Sales Management team
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