ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder. With this coveted…

We are happy to announce that we will be demonstrating the NANO, our ultra-precision die and flip chip bonder for…

ASM AMICRA Microtechnologies' Product Manager, David Halk, has contributed an article "A Closer Look into Sub-micron Die Placement: Cpk and…

AMICRA announces with pleasure that we will be teaming with the European Photonics Industry Consortium (EPIC) to host the EPIC…

AMICRA announces with pleasure the first order of our new NANO Ultra-Precision Die Bonding System from the largest subcon in…

"Growing at the Speed of Light!"- AMICRA is being profiled in the November issue of "European Business." You can find…

All-Electronics is currently featuring an article on AMICRA's latest high precision placement system with an accuracy of +/- 0.3µm at…

AMICRA announces with pleasure the official opening this week of our new headquarter building at Marie-Curie-Str.6 in Regensburg, Germany. The…

All-Electronics is currently featuring an article on the AMICRA High Speed & Precision Dispense System, HDS, on their website. The…

We are happy to announce our newest sales distibution partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation,…

Next week we will be exhibiting at both the SEMICON Taiwan in Taipei, Taiwan (7-9 September) and at the CIOE…

AMICRA is pleased to announce that we have received an order for the AFC Plus System from Fabrinet West. The…

AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for…

Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for…

The AMICRA Microtechnologies' sales team will be returning to the Productronica trade show this year at the Messe München from…

We will be returning again this year to present our high-precision die and flip chip bonders at the SEMICON Taiwan…

"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

AMICRA will be returning again this year to exhibit at the SEMICON West 2015 held at the Moscone Center in…

In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015 held from…

AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from…

A feature article on AMICRA as a technological leader in die bonding can be currently found in the first edition…

AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC…

AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company…

An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily News in…

An article by AMICRA Managing Director, Dr. Johann Weinhändler, discussing silicon photonics is being featured in the "Executive View" of…

AMICRA is happy to announce Globaltech Automation, Inc. as the newest addition to our Asian sales representatives team. Globaltech Automation,…

Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the…

We are pleased to announce that a leading optical device Subcon in Thailand selected the AFCPlus die bonder/flip chip bonder…

AMICRA has received a reorder out of Malaysia for the AIS Wafer Inking system from one of the largest IDMs.

AMICRA will be one of the exhibitors participating in the OFC 2014 from March 11-13, 2014 at the Moscone Center…

AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on…

A short video on AMICRA's innovation process and views of our die bonders/flip chip bonders can be currently found on…

AMICRA would like to welcome our newest distributor PAiTECH Co., Ltd. PAiTECH will be the distributor in Israel for AMICRA…

A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip…

Please come by and visit AMICRA at Productronica in Munich, Germany from 12-15 November, 2013 at Hall/Stand: B2.376 and see…

AMICRA has received a volume order for several AFCPlus Die Bonders/Flip Chip Bonders, which will be installed by a Subcon…

AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of…

An article on AMICRA demonstrating the AFCPlus and NOVAPlus advanced die bonder and flip chip bonders at Semicon Taiwan 2013…

Please come visit AMICRA presenting the NOVAPlus and AFCPlus die bonder and flip chip bonder at booth L1024 at SEMICON…

AMICRA is pleased to announce the first NOVA Plus production system sale for large area fan-out application with a panel…

AMICRA is happy to announce that our presence in the USA will be expanding to the states of Oregon, Washington,…

See the NovaPlus Die / Flip Chip Bonder and the AFCPlus Die / Flip Chip Bonder featured on pages 28…