AMICRA presenting at IMAPS Int. Exhibition on Device Packaging 2014

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AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on hand from March 11- 12, 2014 at Booth 64 at the IMAPS Int. Exhibition on Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ to answer any questions you may have regarding the AFCPlus die bonder and flip chip bonder / NOVAPlus die bonder and flip chip bonder and other AMICRA products. Mr. David Halk will also be giving a presentation on high accuracy die attach from 2:30-3:00 PM during the afternoon technical session on March 12th.

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