Shipment of first NOVA system with 300mm FOUP Loader

%AM, %03 %343 %2014 %07:%Mar

We are happy to announce the shipment of the first NOVA system with a 300mm FOUP Loader. The system will be installed for a Silicon Photonics application in a Class 10 Clean room.

News

ASM AMICRA CoS wins Productronica Innovation Award
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The Newest High Precision Placement System
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Amicra Introduces the NANO: Ultra-Precision Die Attach at +/- 0.3 µm Accuracy at 3 sigma
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An article on our High-Speed Precison Dispensing System, HDS, is featured on pages 18-21 of the May 2017 issue of…
Article on High Speed Precision Dispense System featured on All Electronics
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New Sales Distribution Partnership in Japan
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Exhibiting at SEMICON West 2016
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Exhibiting at the European 3D Summit
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Demonstation of Advanced Die Attach & Flip Chip Bonder and High Speed Dispense System at Productronica 2015
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AMICRA at IWLPC 2015
Next week, AMICRA will be exhibiting from Booth:11 at the IWLPC- International Wafer-Level Packaging Conference and Exhibition held at the…
Exhibiting at Semicon Taiwan 2015
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AMICRA at CIOE 2015
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Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA at SEMICON West 2015
AMICRA will be returning again this year to exhibit at the SEMICON West 2015 held at the Moscone Center in…

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Exhibitor at ECTC 2015
During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at the ECTC 2015…

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AMICRA at OFC 2015
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AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from…
NOVA FanOut Brochure & Product Page Now Online
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Feature Article in WIKO Jan 2015
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Exhibitor at European 3D TSV Summit 2015
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AMICRA at IWLPC 2014
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AMICRA Welcomes Joe Ettipio as Sales Manager for the U.S. Western Region
AMICRA Microtechnologies GmbH is pleased to announce the newest addition to its sales management team, Mr. Joe Ettipio. Joe is…

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Order from multinational telecommunications equipment company
AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company…
Presentation at IMAPS Int. Symposium on Microelectronics 2014
AMICRA Regional Sales Manager, David Halk, will be presenting on Advanced Packaging & Assembly at the IMAPS Int. Symposium on…

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Appearance in Economic Daily News (Taiwan)
An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily News in…
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In just under two weeks (Sept. 22-24, 2014), AMICRA will be exhibiting from Booth 527 at ECOC 2014 held at…
Feature in "SiS" Executive View
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Exhibiting at SEMICON WEST 2014
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Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the…
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AMICRA is happy to share that an order has been received from Germany for the NOVAPlus die bonder and flip…
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Exhibitor at OFC 2014
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Shipment of first NOVA system with 300mm FOUP Loader
We are happy to announce the shipment of the first NOVA system with a 300mm FOUP Loader. The system will…
AMICRA presenting at IMAPS Int. Exhibition on Device Packaging 2014
AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on…
AMICRA Welcomes Newest Regional Sales Manager- Mr. Dave Halk
AMICRA Microtechnologies GmbH is happy to announce that Mr. Dave Halk will be the latest addition to our Regional Sales…

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Video on TV Aktuell Fernsehen für Ostbayern
A short video on AMICRA's innovation process and views of our die bonders/flip chip bonders can be currently found on…
AMICRA at SEMICON Korea 2014
AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager…
New Distributor in Israel
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Story on AMICRA in "productronic"
A story on AMICRA's AFCPlus die bonder and flip chip bonder and NOVAPlus die bonder and flip chip bonder, along…
News & Highlights Feature on AMICRA Die Bonders in EPP
A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip…
AMICRA at IWLPC 2013
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013,…
Come Visit AMICRA at Productronica 2013
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AMICRA on Cover of SiS Magazine
The current issue of Silicon Semiconductor (SiS) is featuring AMICRA as its cover story! Don't forget to read the 3…
Volume order received for AFC Plus
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AMICRA Appears in Taiwan press
The Taiwanese media recently featured AMICRA's NOVAPlus and AFCPlus die bonder and flip chip bonders in various press. Click on…

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Founding of AMICRA PTE Ltd. in Singapore
AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of…

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AMICRA in Economic Daily News (Taiwan)
A news release on AMICRA is appearing today in Economic Daily News in Taiwan. Click here for the full article…
AMICRA featured on I-Micronews
An article on AMICRA demonstrating the AFCPlus and NOVAPlus advanced die bonder and flip chip bonders at Semicon Taiwan 2013…
AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)
An article on AMICRA's continual success was featured in the current 23 August, 2013 issue of the Bavarian newspaper, the…

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First NOVA Plus Production System Sale for Large Area Fan-Out Application
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New Distribution Agreement in Russia
AMICRA is pleased to report the signing of a new distribution agreement with United R&D Lab., JSC located in St.…
New Distribution Agreement in the northwest USA
AMICRA is happy to announce that our presence in the USA will be expanding to the states of Oregon, Washington,…
AMICRA’s First System Sale to HDD Market
AMICRA’s NOVAPlus slected for high volume HDD assembly. This is AMICRA’s first system sale to the HDD market.
AMICRA in Chip Scale Review
See the NovaPlus Die / Flip Chip Bonder and the AFCPlus Die / Flip Chip Bonder featured on pages 28…
AMICRA takes part in university career fair
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AMICRA expands in Regensburg: Second location in West district
AMICRA, the Regensburg manufacturer of high-precision assembly systems, as well as test and marking systems in the microelectronics and semiconductor…

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