Leading Optical Device Subcon in Thailand select AFC Plus

%AM, %08 %341 %2014 %07:%Apr

We are pleased to announce that a leading optical device Subcon in Thailand selected the AFC^Plus die bonder/flip chip bonder for their R&D lab. The system is fully equipped and allows the assembly of all kinds of optical devices such as VCSELs, PD, LD, Lenses on PCB or Silicon substrates.

AMICRA onsite support will work strongly together with our customer in developing new processes and applications.

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