Large panel fan-out wafer-level packaging: accuracy is king

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AMICRA article in Chip Scale Review (March/April 2014)

CSR March/April 2014

A 3-page article entitled "Large panel fan-out wafer-level packaging: accuracy is king" written by AMICRA Managing Director, Dr. Johann Weinhändler, can be found in the current March/April 2014 issue of Chip Scale Review. The discussion on fan-out wafer-level processing can be found on pages 54-56. The full article can be found on Chip Scale Review's website.

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