AMICRA at ECTC 2014

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Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida, USA and have Managing Director, Dr. Johann Weinhaendler answer your questions about the AFC Plus and NOVA Plus die bonder and flip chip bonder.

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