Joe Ettipio received a Bachelor of Science degree in Electrical Engineering from the State University of New York at Buffalo. He got his start into the field as an Electrical Design Engineer for General Dynamics in San Diego, California, which was then followed with him holding Sales Manager positions at Orthodyne Electronics, covering the European community, and Palomar Technologies, specializing in the Western U.S. Through these sales management experiences, Joe has established a proven track-record of creating and optimizing business relationships and markets, successfully managing projects throughout all phases, and maximizing sales results.
Since then, Joe has held several high-ranking leadership positions including being President of JPE Sales, Inc., Director of Sales (Americas) for F&K Delvotec, as well as serving the past 4 years as Director of Sales & Business Development (Worldwide) for McBain Systems. From these positions he has solidified expertise in the area of die attach, wire bonding, inspection and measurement solutions as well as equipment customization to fit technically challenging niche applications requiring specialized optics, high accuracy motion control, automation and more. All of Ettipio’s experiences have given him an understanding on how to define and deliver solutions for complex customer requirements, and a dedication to boost customer satisfaction by meticulously managing projects from inception through installation and follow up. He will be a welcome addition to AMICRA’s sales management team.
AMICRA Microtechnologies GmbH, founded in 2001 and headquartered in Regensburg, Germany, provides leading-edge products and engineering services for backend manufacturing and packaging processes to customers in multiple segments of the electronics industry such as semiconductor backend, fiber-optics and optoelectronics, silicon photonics, TSV, fan-out, LED and MEMS. With its latest die bonder and flip chip bonders, the AFC Plus and NOVA Plus, AMICRA has evolved and optimized traditional bond processes in terms of high precision and low cost. The AFC Plus die and flip-chip bonder offers exceptional precision and extremely high placement accuracy. It was designed for ultra-high-precision bonding at an accuracy of +0.5 µm at 3 Sigma. The NOVA Plus, introduced to the AMICRA portfolio in 2010, is a dual-head die bonder / flip-chip bonder that combines exceptionally high precision bonding (+2.5 μm at 3 Sigma) with high processing speed (<3 sec). AMICRA maintains a growing global sales and support network with representative offices throughout Europe, Israel, Asia Pacific and China, as well as on the U.S. East Coast and Northern and Southern California. More information: www.amicra.com.