AMICRA at IWLPC 2014

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AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC (International Wafer-Level Packaging Conferece) 2014 from November 11-12, 2014 at the DoubleTree by Hilton Hotel in San Jose, CA. Stop by our booth or set up an appointment to discuss our die bonders / flip chip bonders, wafer inking system and dispense & test systems by sending an email to This email address is being protected from spambots. You need JavaScript enabled to view it. .

News

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A Closer Look into Sub-micron Die Placement: Cpk and Cmk
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Ultra High Precision Die Attach with 0.3µm Precision
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"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA at SEMICON West 2015
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AMICRA at IWLPC 2014
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AMICRA in Economic Daily News (Taiwan)
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AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)
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AMICRA in Chip Scale Review
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