AMICRA at IWLPC 2014

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AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC (International Wafer-Level Packaging Conferece) 2014 from November 11-12, 2014 at the DoubleTree by Hilton Hotel in San Jose, CA. Stop by our booth or set up an appointment to discuss our die bonders / flip chip bonders, wafer inking system and dispense & test systems by sending an email to This email address is being protected from spambots. You need JavaScript enabled to view it. .

News

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Ultra High Precision Die Attach with 0.3µm Precision
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Amicra Introduces the NANO: Ultra-Precision Die Attach at +/- 0.3 µm Accuracy at 3 sigma
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Feature Article "New High-Speed Precision Dispensing System" in Global SMT & Packaging
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Article on High Speed Precision Dispense System featured on All Electronics
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Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA at SEMICON West 2015
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AMICRA at IWLPC 2014
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Order from multinational telecommunications equipment company
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Video on TV Aktuell Fernsehen für Ostbayern
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Story on AMICRA in "productronic"
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A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip…
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Come Visit AMICRA at Productronica 2013
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Founding of AMICRA PTE Ltd. in Singapore
AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of…

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AMICRA in Economic Daily News (Taiwan)
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AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)
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Mr. Heng Song Lim joins AMICRA’s Sales Management team
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AMICRA in Chip Scale Review
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AMICRA takes part in university career fair
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AMICRA expands in Regensburg: Second location in West district
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