AMICRA at IWLPC 2014

Friday, 31 October 2014 07:07

AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC (International Wafer-Level Packaging Conferece) 2014 from November 11-12, 2014 at the DoubleTree by Hilton Hotel in San Jose, CA. Stop by our booth or set up an appointment to discuss our die bonders / flip chip bonders, wafer inking system and dispense & test systems by sending an email to This email address is being protected from spambots. You need JavaScript enabled to view it. .

News

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Feature Article "New High-Speed Precision Dispensing System" in Global SMT & Packaging
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Advertisement in Chip Scale Review (May/June) 2015
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Order from multinational telecommunications equipment company
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