AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from March 17th-18th, 2015 at the IMAPS-11th International Conference and Exhibition on Device Packaging taking place at the WekoPa Resort and Casino in Fountain Hills, Arizona USA, to discuss the AMICRA die bonders and flip chip bonders and other products. To set up a meeting, please send us an email at: This email address is being protected from spambots. You need JavaScript enabled to view it..