AMICRA exhibiting at IMAPS- 11th International Conference and Exhibition on Device Packaging

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AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from March 17th-18th, 2015 at the IMAPS-11th International Conference and Exhibition on Device Packaging taking place at the WekoPa Resort and Casino in Fountain Hills, Arizona USA, to discuss the AMICRA die bonders and flip chip bonders and other products. To set up a meeting, please send us an email at: This email address is being protected from spambots. You need JavaScript enabled to view it..

News

ASM AMICRA CoS wins Productronica Innovation Award
ASM AMICRA Microtechnologies GmbH wins the 2019 Productronica Innovation Award for its newly developed CoS (Chip-on-Submount) die-bonder. With this coveted…
Exhibiting at OFC 2019
We are pleased to announce that we will be returning to exhibit at the OFC – Optical Fiber Communication Exhibition…
ASM AMICRA to demonstrate Ultra-Precision Die Bonder NANO at China International Import Expo: 5-10 November (Shanghai)
We are happy to announce that we will be demonstrating the NANO, our ultra-precision die and flip chip bonder for…
Article on Submicron Photonics Placement found on All-Electronics
A German-language article on submicron photonics placement ("Submikron Photonik Platzierung genauer betrachten") written by our Regional Sales Manager (USA East),…
A Closer Look into Sub-micron Die Placement: Cpk and Cmk
ASM AMICRA Microtechnologies' Product Manager, David Halk, has contributed an article "A Closer Look into Sub-micron Die Placement: Cpk and…
A New Era Begins for AMICRA and ASM Pacific Technology
ASM Pacific Technology Acquires Amicra to Enter the Photonics Market Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific…
AMICRA to host EPIC Meeting on Automation Tools for Packaging and Testing at Headquarters
AMICRA announces with pleasure that we will be teaming with the European Photonics Industry Consortium (EPIC) to host the EPIC…
Exhibiting at OFC 2018
We are looking forward to returning again to exhibit at the OFC- Optical Fiber Communication Exhibition, the largest global conference…
First Order Received for the NANO Ultra-Precision Die Bonding System
AMICRA announces with pleasure the first order of our new NANO Ultra-Precision Die Bonding System from the largest subcon in…
Ultra High Precision Die Attach with 0.3µm Precision
An article on the NANO Ultra Precision Die Bonder can be found in the February 2018 edition of the German-language…
"Growing at the Speed of Light"- Article in 'European Business'
"Growing at the Speed of Light!"- AMICRA is being profiled in the November issue of "European Business." You can find…
High Precision Die Bonders to be on Display at Productronica (Nov. 14-17, Munich)
Come and see our high precision die bonders up close from Booth: B2 306 at the Productronica 2017 being held…
The Newest High Precision Placement System
All-Electronics is currently featuring an article on AMICRA's latest high precision placement system with an accuracy of +/- 0.3µm at…
Amicra Introduces the NANO: Ultra-Precision Die Attach at +/- 0.3 µm Accuracy at 3 sigma
Press Release: AMICRA NANO Launch With its newly announced NANO, an ultra-precision die and flip-chip bonder for highly demanding assembly…
AMICRA Announces New Headquarter Building
AMICRA announces with pleasure the official opening this week of our new headquarter building at Marie-Curie-Str.6 in Regensburg, Germany. The…
Feature Article "New High-Speed Precision Dispensing System" in Global SMT & Packaging
An article on our High-Speed Precison Dispensing System, HDS, is featured on pages 18-21 of the May 2017 issue of…
Article on High Speed Precision Dispense System featured on All Electronics
All-Electronics is currently featuring an article on the AMICRA High Speed & Precision Dispense System, HDS, on their website. The…
AMICRA Exhibiting at Optical Fiber Communication Conference and Exhibition (OFC) 2017
We will be returning again this year to exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) being held…
New Sales Distribution Partnership in Japan
We are happy to announce our newest sales distibution partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation,…
AMICRA at the International Wafer-Level Packaging Conference (IWLPC)
AMICRA will be returning again this year to exhibit (Booth: 14) at the International Wafer-Level Packaging Conference (IWLPC 2016) taking…
Exhibitor at SEMICON Taiwan & CIOE
Next week we will be exhibiting at both the SEMICON Taiwan in Taipei, Taiwan (7-9 September) and at the CIOE…
Exhibiting at SEMICON West 2016
We will be returning this year to exhibit from booth: 6173 at the SEMICON West 2016 taking place from July…
AMICRA to Provide Precision Die Attach System to Fabrinet in Silicon Valley
AMICRA is pleased to announce that we have received an order for the AFC Plus System from Fabrinet West. The…
AMICRA at the Electronic Components and Technology Conference (ECTC) 2016
AMICRA will be exhibiting our entire product line at the Electronic Components and Technology Conference (ECTC) 2016 held on June…
AMICRA to Deliver NOVA FanOut Bonder to Asian Contractor
AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for…
Sub Micron Die Attach Solutions Ad in Chip Scale Review (March/April 2016)
The AMICRA advertisement highlighting our sub micron die attach solutions can currently be found on page 27 of the March/April…
AMICRA's Opto Packaging Solutions at OFC 2016
Find out how AMICRA's ultra precision die bonders and flip chip bonders for optical device packaging can provide solutions for…
Exhibiting at the European 3D Summit
AMICRA will be exhibiting at the European 3D Summit from 18-20 January in Grenoble, France held at the MINATEC innovation…
Demonstation of Advanced Die Attach & Flip Chip Bonder and High Speed Dispense System at Productronica 2015
The AMICRA Microtechnologies' sales team will be returning to the Productronica trade show this year at the Messe München from…
AMICRA at IWLPC 2015
Next week, AMICRA will be exhibiting from Booth:11 at the IWLPC- International Wafer-Level Packaging Conference and Exhibition held at the…
Exhibiting at Semicon Taiwan 2015
We will be returning again this year to present our high-precision die and flip chip bonders at the SEMICON Taiwan…
AMICRA at CIOE 2015
AMICRA will be exhibiting at Booth: 1112 from August 31st - September 3rd at the CIOE- China International Optoelectronic Expo…
Meeting the Challenge of Accurately Assembling Active Optical Cables (Article in SiS- Silicon Semiconductor)
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at…

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Advertisement in Chip Scale Review (May/June) 2015
Our latest advertisement for our ultra high precision die & flip chip bonders for semiconductor & optical device packaging can…

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AMICRA at SEMICON West 2015
AMICRA will be returning again this year to exhibit at the SEMICON West 2015 held at the Moscone Center in…

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Exhibitor at ECTC 2015
During the last week of May, AMICRA will be returning to exhibit our high-precision die bonders at the ECTC 2015…

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AMICRA to exhibit at SEMICON Southeast Asia 2015
In just under a month, AMICRA will be exhibiting for the first time at SEMICON Southeast Asia 2015 held from…

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AMICRA at OFC 2015
AMICRA will be exhibiting from booth: 1209 at the OFC 2015 (Optical Fiber Communication Conference and Exposition) taking place from…
AMICRA exhibiting at IMAPS- 11th International Conference and Exhibition on Device Packaging
AMICRA Managing director, Dr. Johann Weinhaendler, and Director of US Business Development, Walter Gisler, will be available from booth#6 from…
NOVA FanOut Brochure & Product Page Now Online
The NOVAFanOut Product page is now online and the correpsonding brochure available to download. To read more about the NOVAFanOut…
Feature Article in WIKO Jan 2015
A feature article on AMICRA as a technological leader in die bonding can be currently found in the first edition…
Exhibitor at European 3D TSV Summit 2015
AMICRA will be exhibiting at booth 9 from January 20-21st in Grenoble, France at the European 3D/TSV Summit held at…
AMICRA at IWLPC 2014
AMICRA Managing Director, Dr. Johann Weinhaendler and Regional Sales Manager, Mr. Joe Ettipio, will be exhibiting from booth:11 at IWLPC…
AMICRA Welcomes Joe Ettipio as Sales Manager for the U.S. Western Region
AMICRA Microtechnologies GmbH is pleased to announce the newest addition to its sales management team, Mr. Joe Ettipio. Joe is…

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Order from multinational telecommunications equipment company
AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company…
Presentation at IMAPS Int. Symposium on Microelectronics 2014
AMICRA Regional Sales Manager, David Halk, will be presenting on Advanced Packaging & Assembly at the IMAPS Int. Symposium on…

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Appearance in Economic Daily News (Taiwan)
An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily News in…
AMICRA at ECOC 2014
In just under two weeks (Sept. 22-24, 2014), AMICRA will be exhibiting from Booth 527 at ECOC 2014 held at…
Feature in "SiS" Executive View
An article by AMICRA Managing Director, Dr. Johann Weinhändler, discussing silicon photonics is being featured in the "Executive View" of…
AMICRA at Semicon Taiwan 2014
AMICRA Microtechnologies will be exhibiting the first week of September (Sept. 3-5, 2014) from Booth 1270 at Semicon Taiwan taking…
New Sales Distributor in the Philippines
AMICRA is happy to announce Globaltech Automation, Inc. as the newest addition to our Asian sales representatives team. Globaltech Automation,…
Exhibiting at SEMICON WEST 2014
In just under a month, AMICRA will be exhibiting from Booth 6260 located in the North Hall of the Moscone…
AMICRA at ECTC 2014
Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the…
Large panel fan-out wafer-level packaging: accuracy is king
AMICRA article in Chip Scale Review (March/April 2014) CSR March/April 2014 A 3-page article entitled "Large panel fan-out wafer-level packaging:…
Leading Optical Device Subcon in Thailand select AFC Plus
We are pleased to announce that a leading optical device Subcon in Thailand selected the AFCPlus die bonder/flip chip bonder…
Order from Germany for NOVA Plus System
AMICRA is happy to share that an order has been received from Germany for the NOVAPlus die bonder and flip…
Reorder of AIS from one of largest IDMs
AMICRA has received a reorder out of Malaysia for the AIS Wafer Inking system from one of the largest IDMs.
Reorder of NOVA Plus from leading optical device manufacturer
A leading optical device manufacturer from Asia has reordered a NOVAPlus die bonder and flip chip bonder from AMICRA. The…
Exhibitor at OFC 2014
AMICRA will be one of the exhibitors participating in the OFC 2014 from March 11-13, 2014 at the Moscone Center…
Shipment of first NOVA system with 300mm FOUP Loader
We are happy to announce the shipment of the first NOVA system with a 300mm FOUP Loader. The system will…
AMICRA presenting at IMAPS Int. Exhibition on Device Packaging 2014
AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on…
AMICRA Welcomes Newest Regional Sales Manager- Mr. Dave Halk
AMICRA Microtechnologies GmbH is happy to announce that Mr. Dave Halk will be the latest addition to our Regional Sales…

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Video on TV Aktuell Fernsehen für Ostbayern
A short video on AMICRA's innovation process and views of our die bonders/flip chip bonders can be currently found on…
AMICRA at SEMICON Korea 2014
AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager…
New Distributor in Israel
AMICRA would like to welcome our newest distributor PAiTECH Co., Ltd. PAiTECH will be the distributor in Israel for AMICRA…
Story on AMICRA in "productronic"
A story on AMICRA's AFCPlus die bonder and flip chip bonder and NOVAPlus die bonder and flip chip bonder, along…
News & Highlights Feature on AMICRA Die Bonders in EPP
A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip…
AMICRA at IWLPC 2013
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013,…
Come Visit AMICRA at Productronica 2013
Please come by and visit AMICRA at Productronica in Munich, Germany from 12-15 November, 2013 at Hall/Stand: B2.376 and see…
AMICRA on Cover of SiS Magazine
The current issue of Silicon Semiconductor (SiS) is featuring AMICRA as its cover story! Don't forget to read the 3…
Volume order received for AFC Plus
AMICRA has received a volume order for several AFCPlus Die Bonders/Flip Chip Bonders, which will be installed by a Subcon…
AMICRA Appears in Taiwan press
The Taiwanese media recently featured AMICRA's NOVAPlus and AFCPlus die bonder and flip chip bonders in various press. Click on…

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Founding of AMICRA PTE Ltd. in Singapore
AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of…

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AMICRA in Economic Daily News (Taiwan)
A news release on AMICRA is appearing today in Economic Daily News in Taiwan. Click here for the full article…
AMICRA featured on I-Micronews
An article on AMICRA demonstrating the AFCPlus and NOVAPlus advanced die bonder and flip chip bonders at Semicon Taiwan 2013…
AMICRA Success Story featured in Bavarian Newspaper (Mittelbayerische Zeitung)
An article on AMICRA's continual success was featured in the current 23 August, 2013 issue of the Bavarian newspaper, the…

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AMICRA to Participate at SEMICON Taiwan 2013
Please come visit AMICRA presenting the NOVAPlus and AFCPlus die bonder and flip chip bonder at booth L1024 at SEMICON…
Mr. Heng Song Lim joins AMICRA’s Sales Management team
AMICRA Microtechnologies would like to announce the addition of Mr. Heng Song Lim to our Sales Management team. Mr. Heng…

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First NOVA Plus Production System Sale for Large Area Fan-Out Application
AMICRA is pleased to announce the first NOVA Plus production system sale for large area fan-out application with a panel…
New Distribution Agreement in Russia
AMICRA is pleased to report the signing of a new distribution agreement with United R&D Lab., JSC located in St.…
New Distribution Agreement in the northwest USA
AMICRA is happy to announce that our presence in the USA will be expanding to the states of Oregon, Washington,…
AMICRA’s First System Sale to HDD Market
AMICRA’s NOVAPlus slected for high volume HDD assembly. This is AMICRA’s first system sale to the HDD market.
AMICRA in Chip Scale Review
See the NovaPlus Die / Flip Chip Bonder and the AFCPlus Die / Flip Chip Bonder featured on pages 28…
AMICRA takes part in university career fair
AMICRA was one of the participating exhibitors to meet with students and prospective job-seekers at the "Career Contact 2013" career…
AMICRA expands in Regensburg: Second location in West district
AMICRA, the Regensburg manufacturer of high-precision assembly systems, as well as test and marking systems in the microelectronics and semiconductor…

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