We are happy to announce that we will be demonstrating the NANO, our ultra-precision die and flip chip bonder for highly demanding assembly tasks, at the 2018 China International Import Expo from November 5-10 at the National Exhibition & Convention Center in Shanghai. You can see the NANO in action at the ASM Booth: 3A6-003 in the High-End Intelligent Equipment section.
Billed as the highest-precision placement system in its class, the NANO supports a ±0.3µm placement accuracy at full speed and at 3 Sigma. The ASM AMICRA NANO offers a host of outstanding features:
- Quantitative parallelism calibration for large panel handling (up to 300mm x 300mm)
- Eutectic, as well as epoxy and UV bonding
- UV dispensing
- In-situ curing
- …and more!
The available dispensing options support all common dispenser technologies, and material traceability. Additionally, NANO offers three different heated options and is equipped for laser soldering and active bond force control.