A Closer Look into Sub-micron Die Placement: Cpk and Cmk

  • Tuesday, 29 May 2018 12:52

ASM AMICRA Microtechnologies' Product Manager, David Halk, has contributed an article "A Closer Look into Sub-micron Die Placement: Cpk and Cmk" in the May/June issue of Chip Scale Review. To become familiar with the terms Cpk and Cmk and their significance when selecting an automated tool for a bonding process that requires sub-micron placement accuracy, you can find the article on the Chip Scale Review website (pages 20-24).

News

This websites is using cookies.