First Order Received for the NANO Ultra-Precision Die Bonding System

  • %AM, %14 %315 %2018 %06:%Feb

AMICRA announces with pleasure the first order of our new NANO Ultra-Precision Die Bonding System from the largest subcon in Taiwan. The NANO is AMICRA's ultra-precision die bonder / flip chip bonder which supports ± 0.3µm @ 3s placement accuracy, offering the highest placement accuracy in its class! It is specialized for highly demanding assembly tasks. Visit our NANO Die Bonder page to find out more information and download the product brochure.

News

This websites is using cookies.