AMICRA at the International Wafer-Level Packaging Conference (IWLPC)

  • Thursday, 06 October 2016 08:46

AMICRA will be returning again this year to exhibit (Booth: 14) at the International Wafer-Level Packaging Conference (IWLPC 2016) taking place from Oct. 18-19th in San Jose, California. The IWLPC Conference, which is now in its 16th year, "brings together the semiconductor industry's most respected authorities to address all aspects of wafer-level, 3-D, TSV, and MEMS device packaging technologies" (Source: IWLPC Official Site).

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