We are happy to announce that we will be demonstrating the NANO, our ultra-precision die and flip chip bonder for highly demanding assembly tasks, at the 2018 China International Import Expo from November 5-10 at the National Exhibition & Convention Center in Shanghai. You can see the NANO in action at the ASM Booth: 3A6-003 in the High-End Intelligent Equipment section.
Billed as the highest-precision placement system in its class, the NANO supports a ±0.3µm placement accuracy at full speed and at 3 Sigma. The ASM AMICRA NANO offers a host of outstanding features:
The available dispensing options support all common dispenser technologies, and material traceability. Additionally, NANO offers three different heated options and is equipped for laser soldering and active bond force control.
A German-language article on submicron photonics placement ("Submikron Photonik Platzierung genauer betrachten") written by our Regional Sales Manager (USA East), David Halk, can be found online on All-Electronics.de
ASM AMICRA Microtechnologies' Product Manager, David Halk, has contributed an article "A Closer Look into Sub-micron Die Placement: Cpk and Cmk" in the May/June issue of Chip Scale Review. To become familiar with the terms Cpk and Cmk and their significance when selecting an automated tool for a bonding process that requires sub-micron placement accuracy, you can find the article on the Chip Scale Review website (pages 20-24).
ASM Pacific Technology Acquires Amicra to Enter the Photonics Market
Singapore and Hong Kong, April 3rd, 2018 - ASM Pacific Technology Ltd. (“ASMPT”) announced that it has completed its acquisition of 100% of the shares of AMICRA Microtechnologies GmbH (“Amicra”). Amicra is a leading supplier of high precision die bonder for the photonics and advanced packaging market. The transaction which completed on April 4th 2018 will bring about a strengthened business, well-placed to serve not only the fast growing Silicon Photonics assembly equipment market but also the wider high precision flip chip and die bonding markets.
Headquartered in Singapore and listed in the Hong Kong Stock Exchange, ASMPT is the world’s largest back-end semiconductor equipment supplier and SMT Solutions provider.
“We are excited about this strategic investment,” said Mr. Lee Wai Kwong, CEO of ASM Pacific Technology. “Amicra’s sub-micron high accuracy die bonder is complementary to the Group’s existing product portfolio. Amicra has a leading position in the photonics market which the Group believes is of high growth potential. I am confident that this combination will further strengthen our future growth opportunities and help to deliver even higher value-add to our customers.”
“Following our increasing penetration of markets for high precision die attach, especially in the rapidly growing area of Silicon Photonics manufacturing, it makes a lot of sense to merge with a strong strategic partner to better support our growing international customers base. With their scale and established international supply chain, sales channel and customers support capability, the merger with ASMPT will allow us to take next steps in the further development of our business. I am happy for Amicra and our customers and I am excited about the opportunity to work with the ASMPT” says Mr Rudolf Kaiser, managing director of Amicra.
AMICRA announces with pleasure that we will be teaming with the European Photonics Industry Consortium (EPIC) to host the EPIC Meeting on Automation Tools for Packaging and Testing at our headquarters in Regensburg, Germany from the 23-24 May, 2019.
EPIC is an industry association that promotes the sustainable development of organizations working in the field of photonics in Europe.
AMICRA announces with pleasure the first order of our new NANO Ultra-Precision Die Bonding System from the largest subcon in Taiwan. The NANO is AMICRA's ultra-precision die bonder / flip chip bonder which supports ± 0.3µm @ 3s placement accuracy, offering the highest placement accuracy in its class! It is specialized for highly demanding assembly tasks. Visit our NANO Die Bonder page to find out more information and download the product brochure.
"Growing at the Speed of Light!"- AMICRA is being profiled in the November issue of "European Business." You can find the full article appearing on page 33 www.european-business.com
Come and see our high precision die bonders up close from Booth: B2 306 at the Productronica 2017 being held Nov 14-17 at the Messe Muenchen (Munich, Germany). This year we will be exhibiting the NOVA Plus and our very newest machine, NANO, which supports a +/- 0.3µm placement accuracy at 3 Sigma.
All-Electronics is currently featuring an article on AMICRA's latest high precision placement system with an accuracy of +/- 0.3µm at 3 sigma. To read the full article in German, please visit All-Electronics' website here.
Press Release: AMICRA NANO Launch
With its newly announced NANO, an ultra-precision die and flip-chip bonder for highly demanding assembly tasks, AMICRA Microtechnologies GmbH, a worldwide leading vendor of back-end processing equipment for advanced packaging applications, is setting another record mark for die-attach accuracy. The NANO will be introduced this November at the upcoming Munich Productronica 2017.
Billed as the highest-precision placement system in its class, the new NANO supports a +/- 0.3µm placement accuracy "at full speed and at 3 Sigma," as Dr Johann Weinhaendler, Amicra's managing director of international marketing, sales and business development, underlines the operational capacity of the company's latest technological development. "The design has been completed and the Cmk tests were successful. Delivery of the first NANO will come before the year is out."
Amicra's NANO offers a host of outstanding features: quantitative parallelism calibration for large panel handling (up to 300mm x 300mm), eutectic, as well as epoxy and UV bonding, UV dispensing, and in-situ curing. The available dispensing options support all common dispenser technologies, and material traceability. Besides, NANO offers three different heated options and is equipped for laser soldering and active bond force control. Compared to the company's previous AFC version, the NANO alignment optics were significantly improved. The machine is built on a vibration-free, high-quality granite platform. Aiming at today's, and future placement demands, NANO enables the reliable handling of ultra-small and very thin die.
With this new offering, AMICRA Microtechnologies GmbH, headquartered in Regensburg, Germany, will substantially extend its leadership position in micro assembly, vision and dynamic alignment, as well as high-speed motion control in sub-micron resolution environments. Besides its well-known high-precision die attachment systems, such as the proven die and flip-chip bonders AFC Plus (sporting a 0.5µm placement accuracy with flexible configuration), and NOVA Plus (+2.5µm accuracy across the extra-large bonding area of 550mm x 630mm), Amicra's product portfolio encompasses high-speed dispensing systems for globe-top, underfill, dam-and-fill, and automated wafer inking systems (AIS, SIS), including customized solutions.
In June 2017 the Amicra headquarter in Regensburg, Germany, has moved locally to a new industrial site and was substantially enlarged to now encompass 5000 square meters of work space, of which 1500 m² are equipped as its main production floor, including a 600m² cleanroom, and a demo space for its AFC and NOVA systems.
AMICRA announces with pleasure the official opening this week of our new headquarter building at Marie-Curie-Str.6 in Regensburg, Germany. The new much larger facility merges the staff from previous locations in Wernerwerkstr. and Lilienthalstr. to now allow for everyone to be on one single campus. The entire AMICRA team is excited about our new headquarters and the added value which it will provide to our customers.
An article on our High-Speed Precison Dispensing System, HDS, is featured on pages 18-21 of the May 2017 issue of Global SMT & Packaging. The current issue with the article can be found here.
We will be returning again this year to exhibit at the Optical Fiber Communication Conference and Exhibition (OFC) being held at the Los Angeles Convention Center in Los Angeles, California, USA. AMICRA representatives will be available at Booth: 2227 to answer your questions about our submicron die attach solutions and complete product line.
"The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals. For over 40 years, OFC has drawn attendees from all corners of the globe to meet and greet, teach and learn, make connections and move business forward.
OFC attracts the biggest names in the field, offers key networking and partnering opportunities, and provides insights and inspiration on the major trends and technology advances affecting the industry" (OFC Official Website).
We are happy to announce our newest sales distibution partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo.
The partnership which officially started on 1 December designates Kanematsu as the exclusive distributor and contact point for sales and service matters for the entire AMICRA Microtechnologies product line in Japan.
AMICRA Microtechnologies, which provides leading-edge products and engineering services for back-end manufacturing and packaging processes, maintains a growing global sales and support network. "The partnership between AMICRA and Kanematsu PWS LTD reinforces AMICRA's continued commitment and expansion in Asia and will enable both companies to work together to provide the best service and support to meet the needs of the growing Japanese market" states AMICRA managing director, Dr. Johann Weinhändler.
The AMICRA Microtechnologies' product portfolio includes the ultra-precision die attach machines AFC Plus, NOVA Plus, and NOVA Fanout, as well as the fully automated, high-speed wafer inking system AIS, the semi-automatic wafer inking system SIS, and the fully automated, high-speed precision dispensing system HDS.
AMICRA will be returning again this year to exhibit (Booth: 14) at the International Wafer-Level Packaging Conference (IWLPC 2016) taking place from Oct. 18-19th in San Jose, California. The IWLPC Conference, which is now in its 16th year, "brings together the semiconductor industry's most respected authorities to address all aspects of wafer-level, 3-D, TSV, and MEMS device packaging technologies" (Source: IWLPC Official Site).
Next week we will be exhibiting at both the SEMICON Taiwan in Taipei, Taiwan (7-9 September) and at the CIOE in Shenzhen, China (6-9 September).
SEMICON Taiwan, being held at the Taipei Nangang Exhibition Center, is one of the most influential microelectronics industry events which takes place annually in Taiwan. SEMICON Taiwan will bring together the world’s leading manufacturers. AMICRA will be available for answering your questions from booth: 676.
We will also have representatives at the German Pavilion (Booth: 1A13-15) at the China International Optoelectronics Expo (CIOE), the world's largest exhibition in optoelectronics industry.
We will be returning this year to exhibit from booth: 6173 at the SEMICON West 2016 taking place from July 12th-14th, 2016 at the Moscone Center in San Francisco, California. "The 46th annual SEMICON West has over 700 exhibitors, connection to over 26,000 professionals from across the entire electronics supply chain, and 250 total hours of programming and events presented by industry leaders" (SEMICON West Offical Site). SEMICON West which is organized by the global industry association, SEMI, serves the manufacturing supply chain for the micro- and nano-electronics industries, including:
Flat Panel Display (FPD)
Micro-electromechanical systems (MEMS)
Printed and flexible electronics
Related micro- and nano-electronics
AMICRA is pleased to announce that we have received an order for the AFC Plus System from Fabrinet West. The equipment will be installed in Fabrinet’s state-of-the-art optical packaging service facility in Santa Clara, California. AMICRA and Fabrinet have agreed to establish a partnership agreement whereby both companies will work together to provide customers with best support for application and process development activities.
“For AMICRA, this is a strategic partnership to support our existing installed base and to support our rapidly growing USA market,” states AMICRA managing director, Dr. Johann Weinhaendler, on the latest purchase order.
The AFC Plus will provide Fabrinet with the die attach capability to maintain its leadership role in the Opto/Photonic contract manufacturing market, while providing sample build capability for AMICRA’s customers in the USA. The AFC Plus has the flexibility to process most advanced packages especially for in-situ eutectic bonding requiring 0.5μm placement accuracy. The AFC Plus system which will be delivered in Q3/2016 and supports die placement accuracies down to ±0.5μm @ 3σ for both eutectic and epoxy bonding with cycle times down to 20 to 30 seconds/bond or 180 to 120 UPH making it well suited for processing VCSEL/AOC, Silicon Photonic, Laser Bar and MEMS components.
“Fabrinet is bringing its advanced optical packaging capabilities to Silicon Valley, where a large portion of our customers are based. AMICRA’s AFC Plus die attach platform sets the industry standard for accuracy, throughput, and robustness. Along with many other capabilities, such as active optical alignment, wire bond, epoxy underfill, laser dicing, and various metrology tools, Fabrinet is planning to offer its customers process/product development services starting in August 2016” states Dr. Hong Hou, Fabrinet’s Executive Vice President and Chief Technical Officer. “The partnership with AMICRA allows Fabrinet to offer the best in class technical support to customers brought by both companies.”
The AMICRA die bonding product line also includes the NOVA Plus, which supports placement accuracies down to ±2.5μm @ 3σ with cycle times down to 3 seconds/bond or 1,200 UPH, and the NOVA FanOut, specifically for the FanOut market, offering a large bonding area of 550mm x 600mm while maintaining die placement accuracies down to ±3.0μm @ 3σ with cycle times down to 1.2 seconds/bond or 3,000 UPH.
Other AMICRA products include the fully automated, high-speed wafer inking system AIS, and the semi-automatic wafer inking system SIS, as well as the fully automated, high-speed precision dispensing system HDS, offered in a quad- or dual-headed configuration to support underfill, glob-top, general dispensing applications and more.
AMICRA will be exhibiting and available for equipment and technical application discussions at ECTC (June 1-2), Semicon West (July 12-14) and Semicon Taiwan (Sept 7-9).
AMICRA Microtechnologies GmbH, a worldwide leading supplier of ultra-precise die bonding equipment, founded in 2001 and headquartered in Regensburg, Germany, provides leading-edge products and engineering services for back-end manufacturing and packaging processes to customers in multiple segments of the electronics industry such as Photonic Integrated Circuits, Active Optical Cable, High Power Laser, WLP, Fan-out, TSV, TCB, Optical Device Packaging, LED and MEMS. With its latest micro-assembly solutions supporting, flip-chip, die-attach and eutectic die-attach AMICRA has optimized traditional bond processes in terms of high precision die placement accuracy. AMICRA maintains a global sales and support network with representative offices throughout Europe, Israel, Asia Pacific and China, as well as North America. More information: www.amicra.com.
Fabrinet is a leading provider of advanced optical packaging and precision optical, electro-mechanical, and electronic manufacturing services to original equipment manufacturers of complex products, such as optical communication components, modules and subsystems, industrial lasers and sensors. Fabrinet offers a broad range of advanced optical and electro-mechanical capabilities across the entire manufacturing process, including process design and engineering, supply chain management, manufacturing, advanced packaging, integration, final assembly and test. Fabrinet focuses on production of high complexity products in any mix and any volume. Fabrinet maintains engineering and manufacturing resources and facilities in Thailand, the People’s Republic of China and the United States of America. For more information visit: www.fabrinet.com.
AMICRA will be exhibiting our entire product line at the Electronic Components and Technology Conference (ECTC) 2016 held on June 1-2, 2016 at The Cosmopolitan of Las Vegas in Las Vegas, NV. The Electronic Components and Technology Conference "is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE" (ECTC Official Website). Stop by our booth: 214 to learn more about AMICRA's offerings.
ECTC Official Website: http://www.ectc.net/
AMICRA Microtechnologies, a German-based vendor of advanced back-end processing equipment for advanced packaging applications, has received a significant order for its NOVA FanOut Large-Panel Die/Flip-Chip Bonder from a large Asian subcontractor located in Taiwan. The AMICRA NOVA FanOut, to be delivered in July 2016, will be part of a large panel pilot manufacturing line.
AMICRA's top-class NOVA FanOut Die/Flip Chip Bonder is laid out for a number of advanced applications such as WLP, MCP, SiP, PoP, eWLB and embedded-die placement tasks. It supports an extremely large 600mm x 550mm bonding area and offers a placement accuracy of +3.0µm at 3 Sigma.
The NOVA FanOut is based on AMICRA's proven dual-head NOVA Plus Die-attach and Flip-chip Placement system introduced in 2010. NOVA FanOut enables its users continuous high-speed processing at a very low cycle time of <3 sec. Auto-loading is provided for wafers up to 300 mm diameter and up to 450 mm substrate wafers, as well as the 550mm x 600 mm substrate working area.
Among the special features of the NOVA FanOut are its software options to optimize the placement accuracy according to the user’s front-end equipment. Its unique dynamic alignment system ensures repeatable placement accuracy while automatically compensating for environmental changes during operation. Additionally, the NOVA FanOut supports heated options for advanced fan-out processes.
Another advanced AMICRA product is the ultra-high-precision AFC Plus Bonding System, which realizes a placement accuracy of +0.5µm at 3 Sigma for die and flip-chip attach. At a cycle time of <30 sec, it is well suited for processing micro-optic and micro-mechanic components, with eutectic bonding via diode laser or heating plate.
AMICRA also offers the fully automated, high-speed wafer inking system AIS, and the semi-automatic wafer inking system SIS. In 2015, AMICRA introduced its fully automated, high-speed precision dispensing system HDS, offered in a quad- or dual-headed configuration to support underfill, glob-top, general dispensing applications and more.
Commenting on this latest purchase order for the NOVA FanOut Large-Panel Bonding System, Johann Weinhaendler, Managing Director of AMICRA Microtechnologies GmbH, stated: "With its large substrate area to accommodate a 550 mm x 600 mm panel in an inline conveyor system and its best placement accuracy of 3µm, the NOVA FanOut provides an optimum die-bonding solution for the fan-out process. This will substantially solidify our innovative position and commitment to the fan-out market.”
AMICRA will demonstrate its current product lines at the upcoming IMAPS Exhibition at OFC 2016 (March 22-24, Anaheim, CA), followed by ECTC 2016 (June 1-2, Las Vegas, NV) and Semicon West (July 12 – 14, San Francisco, CA).
Source: SiS Silicon Semiconductor- http://www.siliconsemiconductor.net/article/98987-AMICRA-to-Deliver-NOVA-FanOut-Bonder-to-Asian-Contractor.php
The AMICRA advertisement highlighting our sub micron die attach solutions can currently be found on page 27 of the March/April 2016 edition of Chip Scale Review. To see the advertisement, please visit Chip Scale Review's website or the link here.
For more information on our ultra precision die placement and flip chip bonders for advanced semiconductor & opto/AOC packaging, please visit our product pages.
AMICRA will be exhibiting at the European 3D Summit from 18-20 January in Grenoble, France held at the MINATEC innovation campus. Please stop by booth 4 to find out how we can meet your die attach needs and TSV technology.
AMICRA will be exhibiting at Booth: 1112 from August 31st - September 3rd at the CIOE- China International Optoelectronic Expo 2015 held at the Shenzhen Conference & Exhibition Center in Shenzhen, China. Regional Sales Manager, Heng Song Lim will be there to answer your questions on how AMICRA's die bonders and flip chip bonders can best serve your opto packaging solution needs.
"Active optical cable (AOC) and silicon photonics technologies are getting attention due to the need to transfer more data at faster rates. This is putting pressure on assembly equipment suppliers to offer advanced tools and processes that push the envelope of ultra-precise die placement."
AMICRA will be exhibiting at booth 9 from January 20-21st in Grenoble, France at the European 3D/TSV Summit held at the MINATEC innovaction campus. To schedule an appointment at the show, please send us an Email.
AMICRA Microtechnologies GmbH is pleased to announce the newest addition to its sales management team, Mr. Joe Ettipio. Joe is the second addition to the U.S. Sales management team this year, and will be responsible specifically for the Western region of the United States. Joe brings along with him 24 years of diverse experience as a technical sales professional, selling and working in the front and backend microelectronics and semiconductor industry, as well as medical and aerospace and defense facilities, predominately located throughout North America and Europe.
AMICRA Microtechnologies is pleased to announce that a multi-million dollar order has been received from a multinational telecommunications equipment company based in Asia. The purchase was for the AMICRA AFC system. This system will be used for the purpose of providing optical device solutions.
AMICRA Regional Sales Manager, David Halk, will be presenting on Advanced Packaging & Assembly at the IMAPS Int. Symposium on Microelectronics 2014 held on October 16th, 2014 from 1:30-1:55 PM at the Town & Country Resort & Conference Center in San Diego, CA. David's presentation is entitled "A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)." A full abstract of the presentation can be found here: Abstract.
An article on the AMICRA die and flip chip bonders was featured in an article in Economic Daily News in Taiwan (September 2014). The article includes a photo of AMICRA Managing Director, Dr. Johann Weinhändler, Regional Sales Manager for Asia, Mr. Heng Song Lim and the director of our Taiwan sales distribution office, Mr. Michael Mou (Schmidtek Ltd.). Click here to read the article.
In just under two weeks (Sept. 22-24, 2014), AMICRA will be exhibiting from Booth 527 at ECOC 2014 held at the Palais des Festivals et des Congrès de Cannes (Cannes, France). Learn more about the AMICRA die bonders and flip chip bonders and how they can meet your fiber optic needs by meeting with Managing Directors Rudolf Kaiser, and Dr. Johann Weinhändler and discuss in full the technologies the AFC Plus and NOVA Plus support.
An article by AMICRA Managing Director, Dr. Johann Weinhändler, discussing silicon photonics is being featured in the "Executive View" of the SiS- Silicon Semiconductor (Volume 36 Issue 3 2014) issue. To read the entire article on page 3, please visit SiS- Silicon Semiconductor's website or click here for the link to the pdf.
AMICRA Microtechnologies will be exhibiting the first week of September (Sept. 3-5, 2014) from Booth 1270 at Semicon Taiwan taking place at the TWTC Nangang Exhibition Hall in Taipei, Taiwan. AMICRA Managing Director, Dr. Johann Weinhaendler, and Regional Sales Manager for Asia, Heng Song Lim, will be onsite to answer your questions about the AMICRA high precision die bonders and flip chip bonders and other products.
For further questions or to set up an appointment to meet with an AMICRA representative, please feel free to contact us.
AMICRA is happy to announce Globaltech Automation, Inc. as the newest addition to our Asian sales representatives team. Globaltech Automation, Inc. will be responsible for the Philippines sales region. Visit our contact page to connect with Globaltech Automation Inc., or visit their website at: www.globaltechphil.com.
In just under a month, AMICRA will be exhibiting from Booth 6260 located in the North Hall of the Moscone Center in San Francisco, California at SEMICON West 2014 (July 8-10, 2014). AMICRA Managing Director, Dr. Johann Weinhaendler as well as US Sales Manager, David Halk and representative Walter Gisler will be present to address any questions on our die bonder and flip bonders and other products.
Stop by Booth#219 from May 28th-29th, 2014 at the 64th Electronic Components and Technology Conference (ECTC 2014) held at the Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida, USA and have Managing Director, Dr. Johann Weinhaendler answer your questions about the AFC Plus and NOVA Plus die bonder and flip chip bonder.
AMICRA article in Chip Scale Review (March/April 2014)
A 3-page article entitled "Large panel fan-out wafer-level packaging: accuracy is king" written by AMICRA Managing Director, Dr. Johann Weinhändler, can be found in the current March/April 2014 issue of Chip Scale Review. The discussion on fan-out wafer-level processing can be found on pages 54-56. The full article can be found on Chip Scale Review's website.
We are pleased to announce that a leading optical device Subcon in Thailand selected the AFCPlus die bonder/flip chip bonder for their R&D lab. The system is fully equipped and allows the assembly of all kinds of optical devices such as VCSELs, PD, LD, Lenses on PCB or Silicon substrates.
AMICRA onsite support will work strongly together with our customer in developing new processes and applications.
AMICRA is happy to share that an order has been received from Germany for the NOVAPlus die bonder and flip chip bonder system, to be used for VCSEL & PIN attach for an active optical cable.
AMICRA has received a reorder out of Malaysia for the AIS Wafer Inking system from one of the largest IDMs.
A leading optical device manufacturer from Asia has reordered a NOVAPlus die bonder and flip chip bonder from AMICRA. The system will be utilized for VCSEL & PIN attach application.
AMICRA will be one of the exhibitors participating in the OFC 2014 from March 11-13, 2014 at the Moscone Center in San Franciso, CA. Managing Director, Dr. Johann Weinhändler, will be on-site at Booth: 3355 presenting the AMICRA die bonder and flip chip bonders (AFCPlus und NOVAPlus) and will be available for questions and inquiries.
We are happy to announce the shipment of the first NOVA system with a 300mm FOUP Loader. The system will be installed for a Silicon Photonics application in a Class 10 Clean room.
AMICRA representatives, David Halk (Regional Sales Manager- USA) and Walter Gisler (Director of Business Development- USA), will both be on hand from March 11- 12, 2014 at Booth 64 at the IMAPS Int. Exhibition on Device Packaging at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ to answer any questions you may have regarding the AFCPlus die bonder and flip chip bonder / NOVAPlus die bonder and flip chip bonder and other AMICRA products. Mr. David Halk will also be giving a presentation on high accuracy die attach from 2:30-3:00 PM during the afternoon technical session on March 12th.
AMICRA Microtechnologies GmbH is happy to announce that Mr. Dave Halk will be the latest addition to our Regional Sales Management team, with a primary focus of serving the market of the USA eastern region. Halk has an extensive technical background serving the Advanced Packaging market within the electronic assembly industry. Most recently before starting at AMICRA, Dave held the position of Project Manager and Business Development Manager at SYNATEC GoA in Chattanooga, TN, where he organized and structured a new distribution channel for North America. Previous to that he served as Business Manager at Siemens Electronic Assembly Systems & Co., located in Atlanta, where he managed and integrated several new products, including die bonders and inspection systems, into Siemens existing distribution channel.
AMICRA will be present at the SEMICON Korea from February 12-14 at the COEX in Seoul, Korea. Regional Sales Manager for Asia, Heng Song Lim will be onsite at booth 4042 to meet visitors and answer your questions about the AMICRA die bonders and flip chip bonders.
A feature article on AMICRA's NOVA Plus die bonder and flip chip bonder and AFC Plus die bonder and flip chip bonder is appearing starting on November 26th in EPP- Elektronik Produktion & Prüftechnik. Visit their website to read the full article: http://www.epp-online.de/news/-/article/32536724/38813779/
Representatives from AMICRA Microtechnologies will be onhand at the International Wafer-Level Packaging Conference (IWLPC) this week, 5- 7 November 2013, in San Jose, CA to answer your questions about the AFC Plus Die Bonder and Flip Chip Bonder / NOVA Plus Die Bonder and Flip Chip Bonder and AMICRA's other products. We will be displaying at the exhibition on 6- 7th November. Stop by at our stand located at Booth #2!
Please come by and visit AMICRA at Productronica in Munich, Germany from 12-15 November, 2013 at Hall/Stand: B2.376 and see the NOVAPlus and AFCPlus Die Bonder and Flip Chip bonders in person! AMICRA's managing directors will be on hand to answer any questions presented. We look forward to your attendance!
The current issue of Silicon Semiconductor (SiS) is featuring AMICRA as its cover story! Don't forget to read the 3 page feature story found on pages 26-28 and take a peak at the advertisement for the Nova Plus and AFC Plus die bonder and flip chip bonders on page 9. Visit the SiS website or click here to read the current issue.
AMICRA has received a volume order for several AFCPlus Die Bonders/Flip Chip Bonders, which will be installed by a Subcon in Thailand.
AMICRA Microtechnologies GmbH, a global leader of high precision micro assembly equipment, is very pleased to announce the founding of AMICRA PTE Ltd. on 2 September 2013, in Singapore. The concept of AMICRA PTE Ltd., came to fruition as a means for AMICRA, the die bonder and flip chip bonder specialist, to provide closer, more direct contact with the ever growing Asian customer base. As the demand for the fast-growing microelectronic market is rapidly increasing, AMICRA strives to meet this need by providing its respected customers with services and products of the utmost quality. Representation on-site in Asia has become an essential next step to continue on with AMICRA’s 15 year track record of providing high quality technological engineering services and products for the entire industry field of microelectronics. The new Singapore office will be led by Managing Director, Dr. Johann Weinhaendler, with Mr. Heng Song Lim serving as Sales Manager for Asia and the primary office contact.
A news release on AMICRA is appearing today in Economic Daily News in Taiwan. Click here for the full article (in Chinese only).
An article on AMICRA's continual success was featured in the current 23 August, 2013 issue of the Bavarian newspaper, the Mittelbayerische Zeitung.
Please come visit AMICRA presenting the NOVAPlus and AFCPlus die bonder and flip chip bonder at booth L1024 at SEMICON Taiwan 2013 taking place at the Nangang Exhibition Hall at the Taipei World Trade Centre in Taipei, Taiwan from Sept 4-6, 2013. On-site will be AMICRA Managing Director, Dr. Johann Weinhändler and Sales Manager, Mr. Heng Song Lim.
AMICRA Microtechnologies would like to announce the addition of Mr. Heng Song Lim to our Sales Management team. Mr. Heng Song Lim brings with him an extensive amount of valuable, global experience in the industry field. Most recently Mr. Heng Song Lim served as the Asia Pacific Business Manager for Nordson March Plasma System Inc, where he successfully increased the Asian customer base, and developed new business accounts. Nordson March Plasma System Inc. is responsible for designing, manufacturing and marketing plasma equipment to improve die bonding and wire bonding yields during the semiconductor assembly process.
AMICRA is pleased to announce the first NOVA Plus production system sale for large area fan-out application with a panel size of 370 x 470 to one of the largest semiconductor packaging subcontractors in Taiwan.
AMICRA is pleased to report the signing of a new distribution agreement with United R&D Lab., JSC located in St. Petersburg, Russia to serve as a distributor of AMICRA products to the Russian Federation.
AMICRA is happy to announce that our presence in the USA will be expanding to the states of Oregon, Washington, Idaho and Utah through the recently signed distribution agreement with distributor NW Test Solutions.
AMICRA’s NOVAPlus slected for high volume HDD assembly. This is AMICRA’s first system sale to the HDD market.
AMICRA was one of the participating exhibitors to meet with students and prospective job-seekers at the "Career Contact 2013" career fair held at the University of Regensburg on the 12th of June, 2013.
AMICRA, the Regensburg manufacturer of high-precision assembly systems, as well as test and marking systems in the microelectronics and semiconductor industry has been on a steady growth path in the recent years. This course of growth has led to a significant expansion in both the production area in the Wernerwerkstraße location, as well as an additional 500 m² of office space being leased in the West district of Regensburg starting in the 2nd quarter of 2013. In order to meet the need for additional skilled workers, employees are now successfully being recruited internationally.