Field Applications Engineer / Die Bonding Specialist - USA (California)

AMICRA Microtechnologies is a worldwide leading manufacturer of production equipment for the electronics and semiconductor industries. AMICRA serves the Advanced Packaging market with a strong focus on the Opto/Photonic market segment. AMICRA is looking for a candidate that can work independently, is a problem solver, good communicator and is comfortable working in a high technology environment.  AMICRA continues to grow and maintains a leadership position in the photonic assembly market.

 Location: Santa Clara, CA

 Primary tasks:

  •           Set-up and prepare customer demonstrations
  •        Establish and test complex bonding processes
  •           Conduct equipment installations
  •        Provide technical phone support
  •        Conduct on-site training
  •           Provide field service support

Minimum Requirements (must have):

  •         2 year technical degree or equivalent qualifications
  •        Good communications skills both spoken and written
  •        Driving attitude with persistency and tenacity to complete tasks
  •        Strong PC skills with the Microsoft software
  •        Self-starter and comfortable working in an independent environment
  •       Team player
  •       Travel is required within North America with a willingness to travel internationally

Additional Requirements (like to have):

  •           Engineering degree or equivalent qualifications
  •      Experience in semiconductor assembly equipment
  •           Experience is die bonding equipment
  •           Expertise with Advanced Packaging and bonding processes

 We offer a future oriented workplace in a modern high-tech enterprise with a highly motivated team. If you are willing to work hard, looking for a learning experience and want to be recognized for your efforts AMICRA is the company for you.

Application materials should be directed to:
AMICRA Microtechnologies GmbH
Stefan Wolf
Wernerwerkstr. 4
93049 Regensburg, Germany
or e-mail: 
This email address is being protected from spambots. You need JavaScript enabled to view it.

 

This websites is using cookies.