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More than Precision: Die Bonder / Flip Chip Bonder Systems - Dispense & Test Systems - Wafer Inking Solutions and more!

 

AMICRA Microtechnologies GmbH

The rapidly fast-growing micro-electronic market demands immediate reaction and advanced engineering know-how. Under the management of Dr. Johann Weinhaendler, Horst Lapsien and Rudolf Kaiser, working together along with our dedicated team of highly experienced, creative technical and manufacturing professionals, we have collected more than 15 years of knowledge in all kinds of advanced micro assembly solutions.

Our earned expertise and experience allows AMICRA microtechnologies to provide customers with state-of-the-art, high-tech products. Our team develops the sytems with modern development tools focusing on:

  • concept development
  • 3D construction
  • development of prototype sytems
  • precision assembly
  • software development
  • customized machine controls
  • process vision systems
  • image processing systems
  • process development and process production transfer
  • sampling and small volume production.

With the headquarters located in picturesque, Regensburg, Germany, AMICRA Microtechnologies has developed an unsurpassed capability of offering leading edge solutions to customers in multiple segments of the microelectronic industry. We also have sales representatives available worldwide in Asia, Europe and throughout the USA. Click on the "Products" tab above to learn more about our die bonders and flip chip bonders, wafer inking systems, and dispense & test systems.

Upcoming Trade Shows

2016

Semicon Japan
Tokyo, Japan
Dec. 14-16, Booth: 1911

2017

European 3D Summit
Grenoble, France
Jan. 23-25, Booth: 4

IMAPS Int. Device Packaging Exhibition
Fountain Hills, AZ
March 7-8, Booth: TBD

OFC 2017
Los Angeles, CA
March 21-23, Booth: 2227

ECTC 2017
Lake Buena Vista, Florida
May 31-June 1, Booth: 504

Semicon West 2017
San Francisco, CA, USA
July 11-13, Booth: 5385

ECOC 2017
Gothenburg, Sweden
Sept 18-20, Booth: 513

News

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