History

History of AMICRA Microtechnologies GmbH

Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015; OFC 2015; SEMICON Southeast Asia 2015; ECTC 2015; SEMICON West 2015

October
- Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
July
- Globaltech Automation is added to our Asian sales representatives team, covering the region of the Philippines
January:
- Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA (See news story Jan. 29, 2014)
- PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
Trade Show Participation: SEMICON Korea 2014 (Seoul, South Korea); OFC 2014 (San Francisco, CA); IMAPS Int. Exhibition on Device Packaging 2014 (Arizona)

July:
- The first system sale to the HDD market is signed with a major European LD manufacturer.
- Announcement of two new distribution agreements- one for the sales territory of the Russian Federation with distributor United R&D Lab., JSC, and the other throughout the northwestern states of the USA with distributor NW Test Solutions).
May/June:
- A second location is added in Regensburg during the 2nd quarter of the year (see news story - 11 June, 2013)
Trade Show Participation: Semicon Taiwan 2013 (Taipei, Taiwan); Semicon West 2013 (San Francisco, USA); OFC 2013 (Anaheim, CA, USA); IWLPC 2013 (San Jose, CA, USA); Productronica 2013 (Munich, Germany)

Delivery of the first LTS Test System and 12" Wafer Inking System.
Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
Multiple system installations at a major optoelectronic packaging house in Thailand.
Trade Show Participation: SMT Hybrid Packaging (Nuremberg, Germany); OFC 2012 (Los Angeles, CA, USA)

Increased number of employees from 35 to 48.
Start of product development for the LTS (LED & LD) Test system and the 12" Wafer Inking System.
Successful product launch of the new AFC^Plus High Precision Die Bonder.
Acquisition of five new customers in Asia and Europe.
Trade Show Participation: Semicon Taiwan (Taiwan); SMT 2011 (Nuremberg); OFC 2011 (Los Angeles, CA, USA)

Product launch of the new NOVA^Plus High Precision Die Bonder.
Largest incoming orders in the company's history.
Received the first orders from Taiwan.
Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.
Trade Show Participation: Seimicon Taiwan (Taiwan), SMT (Nuremberg, Germany), OFC (San Diego, CA, USA)

September:
- Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
June :
- Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
- Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
April :
- Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
February :
- Dr. Johann Weinhaendler joins the management team as head of sales, marketing and business development.
Trade Show Participation: OFC (USA); SMT (Nuremberg, Germany); Semicon Singapore (Singapore); Productronica (Munich, Germany)

December:
- Reconstruction of the company's ownership structure along with recapitalization takes place
August:
- New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
2 AFC die bonders for MEMS Probecard (Korea)
Follow-up orders for AFC Flip Chip
Follow-up orders for the laser process system (LPS)
Trade Show Participation: OFC (USA); SMT; Semicon Taiwan

Development of the AFC Flip Chip
Development of a fully automatic lens characterization system
Trade Show Participation: Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT

Establishment of AMICRA microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
Development of ADB2000 und SDB1000
Trade Show Participation: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen