History of AMICRA Microtechnologies GmbH


  • Trade Show Participation: European 3D TSV Summit; IMAPS International Device Packaging Exhibition 2015; OFC 2015; SEMICON Southeast Asia 2015; ECTC 2015; SEMICON West 2015



  • October      
    • Mr. Joe Ettipio joins the AMICRA Sales Management team as Regional Sales Manager- USA/Canada Western Region (See news story Oct. 1, 2014)
  • July
    • Globaltech Automation is added to our Asian sales representatives team, covering the region of the Philippines
  • January:
    • Mr. David R. Halk joins the AMICRA Sales Management team as Regional Sales Manager- USA (See news story Jan. 29, 2014)
    • PAiTECH Co., Ltd is announced as the new Sales Distributor for Israel
  • Trade Show Participation: SEMICON Korea 2014 (Seoul, South Korea); OFC 2014 (San Francisco, CA); IMAPS Int. Exhibition on Device Packaging 2014 (Arizona)



  • September: Founding of AMICRA PTE Ltd. in Singapore.
  • July:
    • The first system sale to the HDD market is signed with a major European LD manufacturer.
    • Announcement of two new distribution agreements- one for the sales territory of the Russian Federation with distributor United R&D Lab., JSC, and the other throughout the northwestern states of the USA with distributor NW Test Solutions).
  • May/June:
    • A second location is added in Regensburg during the 2nd quarter of the year (see news story - 11 June, 2013)
  • Trade Show Participation: Semicon Taiwan 2013 (Taipei, Taiwan); Semicon West 2013 (San Francisco, USA); OFC 2013 (Anaheim, CA, USA); IWLPC 2013 (San Jose, CA, USA); Productronica 2013 (Munich, Germany)



  • Delivery of the first LTS Test System and 12" Wafer Inking System.
  • Received the first orders from a major Taiwanese Semiconductor Packaging house for a large area Fan-Out application.
  • Multiple system installations at a major optoelectronic packaging house in Thailand.
  • Trade Show Participation: SMT Hybrid Packaging (Nuremberg, Germany); OFC 2012 (Los Angeles, CA, USA)





  • Product launch of the new NOVAPlus High Precision Die Bonder.
  • Largest incoming orders in the company's history.
  • Received the first orders from Taiwan.
  • Dr. Weinhaendler signed five new distribution and representation agreements with trading partners.  
  • Trade Show Participation: Seimicon Taiwan (Taiwan), SMT (Nuremberg, Germany), OFC (San Diego, CA, USA)



  • September:
    • Execution of an exclusive distribution agreement with Schmidtek Ltd. for the Taiwan sales territory
  • June :
    • Execution of an exclusive distribution agreement with Caleo S.A. for the France, Spain, Portugal, and Morocco sales territories.
    • Execution of an exclusive distribution agreement with Interelec AG for the Switzerland sales territory.
  • April :
    • Execution of a distribution agreement with WKK for the Singapore, Malaysia, and Thailand sales territories.
  • February :
  • Trade Show Participation: OFC (USA); SMT (Nuremberg, Germany); Semicon Singapore (Singapore); Productronica (Munich, Germany)



  • December:
    • Reconstruction of the company's ownership structure along with recapitalization takes place
  • August:
    • New company headquarters is stationed at Wernerwerkstr. 4, Regensburg, Germany
  • 2 AFC die bonders for MEMS Probecard (Korea)
  • Follow-up orders for AFC Flip Chip
  • Follow-up orders for the laser process system (LPS)
  • Trade Show Participation: OFC (USA); SMT; Semicon Taiwan



  • Dispenser production line for pressure sensors is completed
  • Order for AFC Flip Chip (Canada) is placed
  • Follow-up orders for AIS are requested
  • Development of the laser lift off system (LPS)
  • Trade Show Participation: SMT; Laser 2007; Productronica



  • Delivery of a completed production line for High Speed Die Bonder NOVA
  • Follow-up orders for AIS
  • Process development of bubble-free silicon membrane
  • Automatic measuring system for silicon membrane
  • Trade Show Participation: SMT; Optatec



  • Development of the AIS (high speed inking with wafer robot)
  • Commencement of development of the high speed die bonder
  • Trade Show Participation: Laser 2005; SMT; Productronica



  • Development of the AFC Flip Chip
  • Development of a fully automatic lens characterization system
  • Trade Show Participation: Hannover Messe (Hannover Trade Fair) (Microsystems Technology); SMT



  • Development of the HIGH SPEED Wafer Inking System
  • Development of the AFC Flip Chip
  • Trade Show Participation: SMT; Laser 2003; Productronica


2001 / 2002

  • Establishment of AMICRA microtechnologies GmbH by Rudolf Kaiser and Horst Lapsien
  • Development of ADB2000 und SDB1000
  • Trade Show Participation: ECOC 2001 Amsterdam; ECOC 2002 Copenhagen

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