Core Strengths

At AMICRA Microtechnologies, we continuously strive to provide our valued customers with extraordinary, high-technological engineering services & products for the whole industry field of microelectronics, specifically including the areas of:

  • Active Optical Cable
  • Fan-Out
  • TSV
  • TCB
  • Process Development
  • Semiconductor Backend
  • Fiber Optics
  • LED
  • Optoelectronics
  • MEMS

AMICRA has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend assemble arena. AMICRA’s Die Attach solutions continue to enable the advanced packaging market to push the boundaries forward and beyond. These unique innovative solutions enable our customer base to achieve some the most accurate die placement performance in the world today while maintaining bonding rates that are 2x and 3x faster than our closest competitor of the markets we serve, resulting in a value proposition that is second to none.

Please visit our Products page for more specific information on our products or contact us at This email address is being protected from spambots. You need JavaScript enabled to view it. with any questions you may have- we would be happy to assist you!

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